Part Details for M2GL025-FCS325I by Microchip Technology Inc
Results Overview of M2GL025-FCS325I by Microchip Technology Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2GL025-FCS325I Information
M2GL025-FCS325I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2GL025-FCS325I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ7724
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Newark | Igloo2 Low Density Fpga, 27.6Kles 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2GL025-FCS325I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$52.4400 / $56.5300 | Buy Now |
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DISTI #
M2GL025-FCS325I
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Avnet Americas | FPGA IGLOO2 27696 Cells 65nm Technology 1.2V 325-Pin FC-BGA - Trays (Alt: M2GL025-FCS325I) COO: Korea (the Republic of) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$54.4125 / $62.1857 | Buy Now |
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DISTI #
M2GL025-FCS325I
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Microchip Technology Inc | IGLOO2 Low Density FPGA, 27.6KLEs, TFBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: EAR99 RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray | In Stock: 0 and Alternates Available |
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$30.4400 / $62.1700 | Buy Now |
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NAC | IGLOO2 Low Density FPGA, 27.6KLEs. Package: 325 TFBGA 11x11x1.01mm TRAY - FPGA Flash Product Line RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray | 0 |
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$53.0900 / $62.1900 | Buy Now |
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DISTI #
M2GL025-FCS325I
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Avnet Silica | FPGA IGLOO2 27696 Cells 65nm Technology 12V 325Pin FCBGA (Alt: M2GL025-FCS325I) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 16 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip Stock | FPGAIGLOO227696Cells65nmTechnology1.2V325-PinFCBGA | 842 |
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RFQ | |
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DISTI #
M2GL025-FCS325I
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EBV Elektronik | FPGA IGLOO2 27696 Cells 65nm Technology 12V 325Pin FCBGA (Alt: M2GL025-FCS325I) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
US Tariff Estimator: M2GL025-FCS325I by Microchip Technology Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for M2GL025-FCS325I
M2GL025-FCS325I Part Data Attributes
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M2GL025-FCS325I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2GL025-FCS325I
Microchip Technology Inc
IGLOO2 Low Density FPGA, 27.6KLEs
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Package Description | Bga, Bga325,21x21,20 | |
| Pin Count | 325 | |
| Manufacturer Package Code | TFBGA-325 | |
| Reach Compliance Code | Not Compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 14 Weeks | |
| JESD-30 Code | S-PBGA-B325 | |
| JESD-609 Code | e0 | |
| Length | 11 Mm | |
| Number of Inputs | 180 | |
| Number of Logic Cells | 27696 | |
| Number of Outputs | 180 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Packing Method | Tray | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.01 Mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin/Lead (Sn63pb37) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Bottom | |
| Width | 11 Mm |
M2GL025-FCS325I Frequently Asked Questions (FAQ)
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Microchip provides a recommended PCB layout in the M2GL025-FCS325I datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using decoupling capacitors to reduce noise and EMI.
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The M2GL025-FCS325I is a highly customizable device. Engineers can use Microchip's Libero SoC software to configure the FPGA for their specific application. The software provides a user-friendly interface to design, implement, and verify digital circuits.
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The M2GL025-FCS325I has a maximum power consumption of 1.2W. Engineers should consider thermal management techniques, such as heat sinks, thermal vias, and PCB layout optimization, to ensure the device operates within its recommended temperature range.
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Microchip provides a secure boot mechanism and secure firmware update features in the M2GL025-FCS325I. Engineers can use the Libero SoC software to implement secure boot and firmware updates, ensuring the integrity and authenticity of the device's firmware.
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Microchip offers various development boards and kits for the M2GL025-FCS325I, such as the M2GL-EVAL-KIT and the PolarFire SoC Icicle Kit. These boards provide a platform for engineers to evaluate and develop their designs.