Part Details for M308A3SGP by Renesas Electronics Corporation
Overview of M308A3SGP by Renesas Electronics Corporation
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Part Details for M308A3SGP
M308A3SGP CAD Models
M308A3SGP Part Data Attributes
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M308A3SGP
Renesas Electronics Corporation
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M308A3SGP
Renesas Electronics Corporation
MROM, 32MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100
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Pbfree Code | Yes | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | QFP | |
Package Description | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 16 | |
Bit Size | 32 | |
CPU Family | M32C/80 | |
Clock Frequency-Max | 32 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PQFP-G100 | |
Length | 14 mm | |
Number of I/O Lines | 88 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (bytes) | 24576 | |
ROM Programmability | MROM | |
Seated Height-Max | 1.7 mm | |
Speed | 32 MHz | |
Supply Current-Max | 45 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |