Part Details for M368L3313ETM-CB0 by Samsung Semiconductor
Overview of M368L3313ETM-CB0 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M368L3313ETM-CB0
M368L3313ETM-CB0 CAD Models
M368L3313ETM-CB0 Part Data Attributes
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M368L3313ETM-CB0
Samsung Semiconductor
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Datasheet
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M368L3313ETM-CB0
Samsung Semiconductor
DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIMM | |
Package Description | DIMM, DIMM184 | |
Pin Count | 184 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 0.75 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 133 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-N184 | |
JESD-609 Code | e0 | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 184 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32MX64 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | DIMM184 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Self Refresh | YES | |
Supply Current-Max | 2.32 mA | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL |
Alternate Parts for M368L3313ETM-CB0
This table gives cross-reference parts and alternative options found for M368L3313ETM-CB0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M368L3313ETM-CB0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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M368L3313CT1-CA2 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313CT1-CA2 |
V826532K04SATG-B0 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Mosel Vitelic Corporation | M368L3313ETM-CB0 vs V826532K04SATG-B0 |
V826532K04SXTG-B0 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Mosel Vitelic Corporation | M368L3313ETM-CB0 vs V826532K04SXTG-B0 |
M368L3313DTL-CA2 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313DTL-CA2 |
M368L3313ETM-CAA | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313ETM-CAA |
V826532K04SATG-75 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Mosel Vitelic Corporation | M368L3313ETM-CB0 vs V826532K04SATG-75 |
M368L3313ETM-CA2 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313ETM-CA2 |
M368L3313ETM-LA2 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313ETM-LA2 |
M368L3313ETM-LAA | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313ETM-LAA |
M368L3313ETM-LB0 | DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | M368L3313ETM-CB0 vs M368L3313ETM-LB0 |