There are no models available for this part yet.
Overview of M470T3354BG0-CCC by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 7 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for M470T3354BG0-CCC by Samsung Semiconductor
Part Data Attributes for M470T3354BG0-CCC by Samsung Semiconductor
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|
|
|---|---|
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Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
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|
Part Package Code
|
SODIMM
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Package Description
|
DIMM, DIMM200,24
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|
Pin Count
|
200
|
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
|
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HTS Code
|
8542.32.00.36
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Access Mode
|
SINGLE BANK PAGE BURST
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Access Time-Max
|
0.6 ns
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Additional Feature
|
AUTO/SELF REFRESH
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Clock Frequency-Max (fCLK)
|
200 MHz
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I/O Type
|
COMMON
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JESD-30 Code
|
R-XZMA-N200
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Memory Density
|
2147483648 bit
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Memory IC Type
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DDR DRAM MODULE
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Memory Width
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64
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Number of Functions
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1
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Number of Ports
|
1
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Number of Terminals
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200
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Number of Words
|
33554432 words
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Number of Words Code
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32000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
95 °C
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Operating Temperature-Min
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|
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Organization
|
32MX64
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Output Characteristics
|
3-STATE
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Package Body Material
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UNSPECIFIED
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Package Code
|
DIMM
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Package Equivalence Code
|
DIMM200,24
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Package Shape
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RECTANGULAR
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Package Style
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MICROELECTRONIC ASSEMBLY
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Peak Reflow Temperature (Cel)
|
230
|
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Qualification Status
|
Not Qualified
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Refresh Cycles
|
8192
|
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Self Refresh
|
YES
|
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Supply Current-Max
|
1.5 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
NO
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Technology
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CMOS
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Temperature Grade
|
OTHER
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Terminal Form
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NO LEAD
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Terminal Pitch
|
0.6 mm
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Terminal Position
|
ZIG-ZAG
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Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
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Alternate Parts for M470T3354BG0-CCC
This table gives cross-reference parts and alternative options found for M470T3354BG0-CCC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M470T3354BG0-CCC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M470T3354CZ3-CCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354CZ3-CCC |
| M470T3354BZ3-CCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354BZ3-CCC |
| M470T3354BZ3-LCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354BZ3-LCC |
| M470T3354CZ3-LCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354CZ3-LCC |
| M470T3354BZ0-LCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354BZ0-LCC |
| M470T3354BZ0-CCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354BZ0-CCC |
| M470T3354EZ3-LCC | DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | Samsung Semiconductor | M470T3354BG0-CCC vs M470T3354EZ3-LCC |