Part Details for MAX32590-LNJ+ by Maxim Integrated Products
Overview of MAX32590-LNJ+ by Maxim Integrated Products
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Price & Stock for MAX32590-LNJ+
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MAX32590-LNJ+-ND
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DigiKey | IC MCU 32BIT ROMLESS 324CSBGA Min Qty: 10 Lead time: 20 Weeks Container: Bulk MARKETPLACE PRODUCT |
131 In Stock |
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$31.7700 | Buy Now |
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DISTI #
505-MAX32590-LNJ+-ND
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DigiKey | IC MCU 32BIT ROMLESS 324CSBGA Min Qty: 10 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
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Rochester Electronics | MAX32590 Deepcover Secure Microcontroller With Arm926Ej-S Processor Core RoHS: Compliant Status: Active Min Qty: 1 | 131 |
|
$27.2700 / $32.0800 | Buy Now |
Part Details for MAX32590-LNJ+
MAX32590-LNJ+ CAD Models
MAX32590-LNJ+ Part Data Attributes
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MAX32590-LNJ+
Maxim Integrated Products
Buy Now
Datasheet
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MAX32590-LNJ+
Maxim Integrated Products
RISC Microcontroller, FLASH, 384MHz, CMOS, PBGA324, 15 X 15 MM, ROHS COMPLIANT, CSBGA-324
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Part Package Code | BGA | |
| Package Description | CSBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | ARM926EJ-S92 | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 16 | |
| Number of I/O Lines | 160 | |
| Number of Terminals | 324 | |
| Number of Timers | 3 | |
| On Chip Data RAM Width | 8 | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 393216 | |
| Seated Height-Max | 1.4 mm | |
| Speed | 384 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |