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Overview of MB87077P by FUJITSU Semiconductor Limited
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
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CAD Models for MB87077P by FUJITSU Semiconductor Limited
Part Data Attributes for MB87077P by FUJITSU Semiconductor Limited
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FUJITSU LTD
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP24,.3
|
Pin Count
|
24
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.39.00.01
|
Additional Feature
|
EASY MICROPROCESSOR INTERFACE
|
Channel Separation
|
80 dB
|
Consumer IC Type
|
VOLUME CONTROL CIRCUIT
|
JESD-30 Code
|
R-PDIP-T24
|
JESD-609 Code
|
e0
|
Length
|
29.72 mm
|
Number of Channels
|
4
|
Number of Functions
|
1
|
Number of Terminals
|
24
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
-20 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP24,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
4.36 mm
|
Supply Current-Max
|
5 mA
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
7.62 mm
|