Part Details for MC68360CZQ25L by NXP Semiconductors
Overview of MC68360CZQ25L by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MC68360CZQ25L
Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 1012 |
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RFQ |
Part Details for MC68360CZQ25L
MC68360CZQ25L CAD Models
MC68360CZQ25L Part Data Attributes
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MC68360CZQ25L
NXP Semiconductors
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MC68360CZQ25L
NXP Semiconductors
10Mbps, SERIAL COMM CONTROLLER, PBGA357
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Additional Feature | ALSO OPERATES AT 5 V SUPPLY | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | 68000 | |
Clock Frequency-Max | 25 MHz | |
Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | |
Data Encoding/Decoding Method | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
Data Transfer Rate-Max | 10 MBps | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 2 | |
Number of I/O Lines | 46 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 357 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 2560 | |
Seated Height-Max | 1.86 mm | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 3.3 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Alternate Parts for MC68360CZQ25L
This table gives cross-reference parts and alternative options found for MC68360CZQ25L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC68360CZQ25L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MC68360CVR25L | LOCAL AREA NETWORK CONTROLLER, PBGA357 | NXP Semiconductors | MC68360CZQ25L vs MC68360CVR25L |