Part Details for MC68360ZQ33L by NXP Semiconductors
Overview of MC68360ZQ33L by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MC68360ZQ33L
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25967524
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Verical | MPU ColdFire M683xx Processor RISC 32bit 0.57um 33MHz 357-Pin BGA Tray RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1115 | Americas - 198 |
|
$68.8800 | Buy Now |
|
Flip Electronics | Stock, ship today | 220 |
|
$84.8700 | RFQ |
Part Details for MC68360ZQ33L
MC68360ZQ33L CAD Models
MC68360ZQ33L Part Data Attributes
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MC68360ZQ33L
NXP Semiconductors
Buy Now
|
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MC68360ZQ33L
NXP Semiconductors
10Mbps, SERIAL COMM CONTROLLER, PBGA357
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO OPERATES AT 5 V SUPPLY | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | 68000 | |
Clock Frequency-Max | 25 MHz | |
Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | |
Data Encoding/Decoding Method | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
Data Transfer Rate-Max | 10 MBps | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 2 | |
Number of I/O Lines | 46 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 357 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 2560 | |
Seated Height-Max | 1.86 mm | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 3.3 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Alternate Parts for MC68360ZQ33L
This table gives cross-reference parts and alternative options found for MC68360ZQ33L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC68360ZQ33L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MC68360VR33L | 10Mbps, SERIAL COMM CONTROLLER, PBGA357 | NXP Semiconductors | MC68360ZQ33L vs MC68360VR33L |