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MCR01MRTF1004 by: ROHM Semiconductor
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Price & Stock for: MCR01MRTF1004

Distributor Stock MOQ Package QTY Break / Prices
View this part on Avnet Asia 0 10,000
  • 10,000 $0.0103
  • 30,000 $0.0026
View this part on CoreStaff Co Ltd 960 1
  • 1 $0.0410
  • 10 $0.0340
  • 50 $0.0140
  • 100 $0.0140
  • 500 $0.0090
  • 1,000 $0.0070
View this part on CoreStaff Co Ltd 10,000 1
  • 1 $0.0410
  • 10 $0.0340
  • 50 $0.0140
  • 100 $0.0140
  • 500 $0.0090
  • 1,000 $0.0070
View this part on CoreStaff Co Ltd 1,123 1
  • 1 $0.0410
  • 10 $0.0340
  • 50 $0.0140
  • 100 $0.0140
  • 500 $0.0090
  • 1,000 $0.0070

Purchasing Insights: MCR01MRTF1004

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Distributors with Stock

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12,083

Part Details for: MCR01MRTF1004

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: MCR01MRTF1004

Part Number Description Manufacturer Compare
MC0402-1004-FTW Resistors Fixed Resistor, Metal Glaze/thick Film, 0.063W, 1000000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP RCD Components Inc MCR01MRTF1004 vs MC0402-1004-FTW
MC0402-1004-FBW Resistors Fixed Resistor, Metal Glaze/thick Film, 0.063W, 1000000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP RCD Components Inc MCR01MRTF1004 vs MC0402-1004-FBW
CR0402-16W-1004FSNT-13 Resistors Fixed Resistor, Metal Glaze/thick Film, 0.063W, 1000000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT VENKEL LTD MCR01MRTF1004 vs CR0402-16W-1004FSNT-13

Resources and Additional Insights

Reference Designs

  • Wi-Fi Enabled IoT Node with High Performance MCU Reference Design
    TIDM-TM4C129XWIFI: A system example to show how to build a Wi-Fi Node by integrating the TM4C1294 MCU from the TM4C product family and the CC3100 network processor. This reference design demonstrates the capability of remotely controlling MCU operation via the internet.
  • Wi-Fi Enabled IoT Node With NFC Connection Handover Reference Design
    TIDM-TM4C129XNFC: Configuring Wi-Fi network connection parameters in embedded applications can be completed with a simple tap using NFC technology. This reference design illustrates NFC connection handover (pairing) and URL sharing with a Wi-Fi node using a TM4C1294 high-performance microcontroller, CC3100 network processor and TRF7970A NFC Transceiver or RF430CL330H NFC Transponder.
  • Microstepping Stepper Motor Control With MCU and Wi-Fi for IoT Reference Design
    TIDM-TM4C123IOTSTEPPERMOTOR: A system example to show how to control a stepper motor via Wi-Fi connectivity. The TM4C123x MCU is integarated with the DRV8833 stepper motor driver to drive the stepper moter in full step, half step and microstep (up to 256) modes. The SimpleLinkTM Wi-Fi CC3100 network processor is also integrated into the system to demostatrate the capability of remotely controlling MCU/stepper motor operation via the Internet.
  • BLE Enabled IoT Node With High Performance MCU Reference Design
    TIDM-TM4C129XBLE: A system example to show how to build a BLE Node by integrating a TM4C1294 MCU from the TM4C product family and a CC2650 device. This reference design demostatrates the capability of remotely controlling MCU operation via the internet.
  • Driving a Stepper Motor Reference Design with High Performance MCU
    TIDM-TM4C123STEPPERMOTOR: An system example to show how to drive a stepper motor in full step and halfstep modes using a TM4C123 MCU and DRV8833 stepper motor driver.

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