Part Details for MH88205 by Microsemi Corporation
Overview of MH88205 by Microsemi Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for MH88205
MH88205 CAD Models
MH88205 Part Data Attributes
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MH88205
Microsemi Corporation
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Datasheet
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MH88205
Microsemi Corporation
DTMF Signaling Circuit, BICMOS, CDIP50,
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-XDIP-T50 | |
| Number of Terminals | 50 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP50,1.5 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Technology | BICMOS | |
| Telecom IC Type | DTMF SIGNALING CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |