Part Details for MH886121 by Microsemi Corporation
Overview of MH886121 by Microsemi Corporation
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for MH886121
MH886121 CAD Models
MH886121 Part Data Attributes
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MH886121
Microsemi Corporation
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Datasheet
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MH886121
Microsemi Corporation
TELECOM-SLIC, PSIP20, LEAD FREE, SIP-20
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
| Part Package Code | SIP | |
| Package Description | SIP, | |
| Pin Count | 20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PSIP-T20 | |
| JESD-609 Code | e3 | |
| Neg Supply Voltage-Nom | -5 V | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 15.24 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Telecom IC Type | SLIC | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | SINGLE |