Part Details for ML7050LA by LAPIS Semiconductor Co Ltd
Overview of ML7050LA by LAPIS Semiconductor Co Ltd
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- Part Data Attributes: (Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for ML7050LA
ML7050LA CAD Models
ML7050LA Part Data Attributes:
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ML7050LA
LAPIS Semiconductor Co Ltd
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Datasheet
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ML7050LA
LAPIS Semiconductor Co Ltd
Telecom IC, CMOS, PBGA48,
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | FBGA, BGA48,8X8,32 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B48 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 55 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,8X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |