Part Details for MLG1608B2N2ST000 by TDK Corporation
Results Overview of MLG1608B2N2ST000 by TDK Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MLG1608B2N2ST000 Information
MLG1608B2N2ST000 by TDK Corporation is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.
Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.
Price & Stock for MLG1608B2N2ST000
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 8000 |
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RFQ |
US Tariff Estimator: MLG1608B2N2ST000 by TDK Corporation
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for MLG1608B2N2ST000
MLG1608B2N2ST000 CAD Models
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MLG1608B2N2ST000 Part Data Attributes
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MLG1608B2N2ST000
TDK Corporation
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Datasheet
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MLG1608B2N2ST000
TDK Corporation
General Purpose Inductor, 0.0022uH, 13.637%, 1 Element, Ferrite-Core, SMD, 1608, CHIP, 1608, ROHS COMPLIANT
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Package Description | Chip, 1608, Rohs Compliant | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8504.50.80.00 | |
| Case/Size Code | 1608 | |
| Construction | Multilayer Chip | |
| Core Material | Ferrite | |
| DC Resistance | 0.1 Ω | |
| Inductance-Nom (L) | 0.0022 µH | |
| Inductor Application | Rf Inductor | |
| Inductor Type | General Purpose Inductor | |
| JESD-609 Code | e3 | |
| Number of Functions | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Height | 0.8 Mm | |
| Package Length | 1.6 Mm | |
| Package Style | Smt | |
| Package Width | 0.8 Mm | |
| Packing Method | Tr, 7 Inch | |
| Quality Factor-Min (at L-nom) | 10 | |
| Rated Current-Max | 0.6 A | |
| Self Resonance Frequency | 8000 Mhz | |
| Shape/Size Description | Rectangular Package | |
| Shielded | No | |
| Special Feature | Inductance Tolerance Is 0.3 Nano Henry | |
| Surface Mount | Yes | |
| Terminal Finish | Tin | |
| Terminal Placement | Dual Ended | |
| Terminal Shape | Wraparound | |
| Test Frequency | 100 Mhz | |
| Tolerance | 13.637% |
MLG1608B2N2ST000 Frequently Asked Questions (FAQ)
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The recommended land pattern for MLG1608B2N2ST000 can be found in the TDK Corporation's application note or footprint library. It is essential to follow the recommended land pattern to ensure proper mounting and to prevent soldering issues.
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Handle the MLG1608B2N2ST000 by the edges or the body, avoiding touching the electrodes or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
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The maximum reflow temperature for MLG1608B2N2ST000 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
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The MLG1608B2N2ST000 is designed to withstand moderate vibration levels. However, it is essential to evaluate the component's performance in your specific application, considering factors like vibration frequency, amplitude, and duration. You may need to add additional mechanical support or consider a different component if the vibration levels are extreme.
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Store the MLG1608B2N2ST000 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Keep the storage area clean and dry, and avoid stacking components on top of each other. Follow the storage conditions recommended by TDK Corporation to maintain the component's shelf life.