Datasheets
MPC555LFMZP40 by:

RISC Microcontroller, 32-Bit, HCMOS, PBGA272, PLASTIC, BGA-272

Part Details for MPC555LFMZP40 by Motorola Semiconductor Products

Overview of MPC555LFMZP40 by Motorola Semiconductor Products

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for MPC555LFMZP40

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MPC555LFMZP40 Part Data Attributes

MPC555LFMZP40 Motorola Semiconductor Products
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MPC555LFMZP40 Motorola Semiconductor Products RISC Microcontroller, 32-Bit, HCMOS, PBGA272, PLASTIC, BGA-272
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Package Description PLASTIC, BGA-272
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Has ADC YES
Additional Feature IT ALSO OPERATES AT 5 V
Address Bus Width 24
Bit Size 32
Boundary Scan YES
CPU Family MPC500
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 32
Format FLOATING-POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B272
Length 27 mm
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 8
Number of I/O Lines 101
Number of Serial I/Os 4
Number of Terminals 272
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA272,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
RAM (bytes) 26624
ROM (words) 458752
ROM Programmability FLASH
Seated Height-Max 2.65 mm
Speed 40 MHz
Supply Current-Max 250 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology HCMOS
Temperature Grade AUTOMOTIVE
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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