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Part Details
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Manufacturer Part Number:
MPC8541EVTAPF
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Ihs Manufacturer:
NXP SEMICONDUCTORS
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Package Description:
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
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Reach Compliance Code:
unknown
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ECCN Code:
5A002.A.1
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HTS Code:
8542.31.00.01
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Manufacturer:
NXP Semiconductors
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Risk Rank:
5.23
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Address Bus Width:
64
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Bit Size:
32
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Boundary Scan:
YES
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Clock Frequency-Max:
166 MHz
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External Data Bus Width:
64
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Format:
FLOATING POINT
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Integrated Cache:
YES
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JESD-30 Code:
R-PBGA-B783
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JESD-609 Code:
e2
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Length:
29 mm
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Low Power Mode:
YES
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Moisture Sensitivity Level:
3
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Number of Terminals:
783
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Operating Temperature-Max:
105 °C
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Package Body Material:
PLASTIC/EPOXY
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Package Code:
HBGA
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Package Shape:
RECTANGULAR
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Package Style:
GRID ARRAY, HEAT SINK/SLUG
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Peak Reflow Temperature (Cel):
260
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Qualification Status:
Not Qualified
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Seated Height-Max:
3.75 mm
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Speed:
833 MHz
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Supply Voltage-Max:
1.26 V
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Supply Voltage-Min:
1.14 V
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Supply Voltage-Nom:
1.2 V
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Surface Mount:
YES
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Technology:
CMOS
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Temperature Grade:
OTHER
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Terminal Finish:
TIN COPPER/TIN SILVER
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Terminal Form:
BALL
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Terminal Pitch:
1 mm
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Terminal Position:
BOTTOM
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Time@Peak Reflow Temperature-Max (s):
40
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Width:
29 mm
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uPs/uCs/Peripheral ICs Type:
MICROPROCESSOR, RISC
CAD Models Information
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