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MSC2327C-80BS8 by:

Fast Page DRAM Module, 256KX32, 80ns, CMOS, PSMA72,

Part Details for MSC2327C-80BS8 by LAPIS Semiconductor Co Ltd

Overview of MSC2327C-80BS8 by LAPIS Semiconductor Co Ltd

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for MSC2327C-80BS8

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MSC2327C-80BS8 Part Data Attributes

MSC2327C-80BS8 LAPIS Semiconductor Co Ltd
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MSC2327C-80BS8 LAPIS Semiconductor Co Ltd Fast Page DRAM Module, 256KX32, 80ns, CMOS, PSMA72,
Part Life Cycle Code Transferred
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD
Package Description SIMM, SSIM72
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Time-Max 80 ns
I/O Type COMMON
JESD-30 Code R-PSMA-N72
Memory Density 8388608 bit
Memory IC Type FAST PAGE DRAM MODULE
Memory Width 32
Number of Terminals 72
Number of Words 262144 words
Number of Words Code 256000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code SIMM
Package Equivalence Code SSIM72
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified
Refresh Cycles 512
Seated Height-Max 25.4 mm
Standby Current-Max 0.008 A
Supply Current-Max 0.4 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position SINGLE

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