Part Details for NAND01GW3B2BZA6F by Numonyx Memory Solutions
Overview of NAND01GW3B2BZA6F by Numonyx Memory Solutions
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Computing and Data Storage
Part Details for NAND01GW3B2BZA6F
NAND01GW3B2BZA6F CAD Models
NAND01GW3B2BZA6F Part Data Attributes
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NAND01GW3B2BZA6F
Numonyx Memory Solutions
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Datasheet
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NAND01GW3B2BZA6F
Numonyx Memory Solutions
Flash, 128MX8, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 PITCH, ROHS COMPLIANT, VFBGA-63
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NUMONYX | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA63,10X12,32 | |
| Pin Count | 63 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 25000 ns | |
| Command User Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 1K | |
| Number of Terminals | 63 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Page Size | 2K words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.05 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | NO | |
| Type | SLC NAND TYPE | |
| Width | 9 mm |
Alternate Parts for NAND01GW3B2BZA6F
This table gives cross-reference parts and alternative options found for NAND01GW3B2BZA6F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NAND01GW3B2BZA6F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NAND01GW3B2CZA6F | Flash, 128MX8, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63 | Micron Technology Inc | NAND01GW3B2BZA6F vs NAND01GW3B2CZA6F |
| NAND01GW3B2CZA6E | Flash, 128MX8, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63 | Micron Technology Inc | NAND01GW3B2BZA6F vs NAND01GW3B2CZA6E |