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NCV7351D13R2G by: onsemi
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Price & Stock for: NCV7351D13R2G

Distributor Stock MOQ Package QTY Break / Prices
View this part on Avnet Americas 0 3,000 Reel
  • 3,000 $0.5413
  • 6,000 $0.5269
  • 12,000 $0.5125
  • 18,000 $0.4980
  • 24,000 $0.4836
View this part on Newark 0 3,000 TAPE & REEL FULL
  • 3,000 $0.5590
View this part on Newark 0 1,000 TAPE & REEL CUT
  • 1,000 $0.5740
View this part on RS Components 0 10 Reel
  • 10 $1.2260
  • 50 $1.0110
  • 200 $0.8800
  • 500 $0.7780
View this part on RS Components 0 10 Package
  • 10 $1.2260
  • 50 $1.0110
  • 200 $0.8800
  • 500 $0.7780

Purchasing Insights: NCV7351D13R2G

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

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Part Details for: NCV7351D13R2G

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: NCV7351D13R2G

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935290794118 Telecommunication Circuits DATACOM, INTERFACE CIRCUIT, PDSO8 NXP Semiconductors NCV7351D13R2G vs 935290794118
MAX13052ASA/AUT Telecommunication Circuits Interface Circuit, BICMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 Maxim Integrated Products NCV7351D13R2G vs MAX13052ASA/AUT
TLE7250GXUMA1 Telecommunication Circuits Interface Circuit, PDSO8, GREEN, PLASTIC, SOP-8 Infineon Technologies AG NCV7351D13R2G vs TLE7250GXUMA1
AMIS42675ICAA1RG Telecommunication Circuits CAN Transceiver, High Speed, Low Power, SOIC-8 Narrow Body, 3000-REEL onsemi NCV7351D13R2G vs AMIS42675ICAA1RG
TJA1050T Telecommunication Circuits CAN Transceiver, 1-Trnsvr, CMOS, PDSO8, Philips Semiconductors NCV7351D13R2G vs TJA1050T
PCA82C251T/N,112 Telecommunication Circuits PCA82C251T NXP Semiconductors NCV7351D13R2G vs PCA82C251T/N,112
Part Number Description Manufacturer Compare
TJA1050T Telecommunication Circuits CAN Transceiver, 1-Trnsvr, CMOS, PDSO8, Philips Semiconductors NCV7351D13R2G vs TJA1050T
AMIS42675ICAA1RG Telecommunication Circuits CAN Transceiver, High Speed, Low Power, SOIC-8 Narrow Body, 3000-REEL onsemi NCV7351D13R2G vs AMIS42675ICAA1RG
TLE7250GXUMA1 Telecommunication Circuits Interface Circuit, PDSO8, GREEN, PLASTIC, SOP-8 Infineon Technologies AG NCV7351D13R2G vs TLE7250GXUMA1
TJA1040T/N1,112 Telecommunication Circuits TJA1040 - High-speed CAN transceiver with standby mode SOIC 8-Pin NXP Semiconductors NCV7351D13R2G vs TJA1040T/N1,112
PCA82C251T Telecommunication Circuits CAN Transceiver, 1-Trnsvr, BICMOS, PDSO8, Philips Semiconductors NCV7351D13R2G vs PCA82C251T
PCA82C251T/N,112 Telecommunication Circuits PCA82C251T NXP Semiconductors NCV7351D13R2G vs PCA82C251T/N,112
PCA82C251TD Telecommunication Circuits IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012AA, SOT-96-1, SOP-8, Network Interface NXP Semiconductors NCV7351D13R2G vs PCA82C251TD
935290794118 Telecommunication Circuits DATACOM, INTERFACE CIRCUIT, PDSO8 NXP Semiconductors NCV7351D13R2G vs 935290794118
MAX13052ASA/AUT Telecommunication Circuits Interface Circuit, BICMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 Maxim Integrated Products NCV7351D13R2G vs MAX13052ASA/AUT
MCP2542FDT-E/SN Telecommunication Circuits DATACOM, INTERFACE CIRCUIT Microchip Technology Inc NCV7351D13R2G vs MCP2542FDT-E/SN

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