There are no models available for this part yet.
Overview of PM4359-NGI by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
CAD Models for PM4359-NGI by Microsemi Corporation
Part Data Attributes for PM4359-NGI by Microsemi Corporation
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Package Description
|
17 X 17 MM, ROHS COMPLIANT, CABGA-256
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
S-PBGA-B256
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
256
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Supply Voltage-Nom
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Telecom IC Type
|
FRAMER
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|
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