There are no models available for this part yet.
Overview of PNX8526EH by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
CAD Models for PNX8526EH by NXP Semiconductors
Part Data Attributes for PNX8526EH by NXP Semiconductors
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
BGA
|
|
Package Description
|
HBGA,
|
|
Pin Count
|
456
|
|
Manufacturer Package Code
|
SOT-610-1
|
|
Reach Compliance Code
|
unknown
|
|
HTS Code
|
8542.39.00.01
|
|
Additional Feature
|
ALSO REQUIRES 1.2V TO 1.32V SUPPLY
|
|
Consumer IC Type
|
CONSUMER CIRCUIT
|
|
JESD-30 Code
|
S-PBGA-B456
|
|
Length
|
35 mm
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
456
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HBGA
|
|
Package Equivalence Code
|
BGA456,26X26,50
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.6 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
35 mm
|