Part Details for PSB21150HV1.4 by Infineon Technologies AG
Overview of PSB21150HV1.4 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for PSB21150HV1.4
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-PSB21150HV1.4-ND
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DigiKey | IPAC-X ISDN PC ADAPTER CIRCUIT Min Qty: 26 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
2764 In Stock |
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$11.9400 | Buy Now |
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Rochester Electronics | PSB21150 - IPAC-X ISDN PC Adapter Circuit ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 2764 |
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$10.2500 / $12.0600 | Buy Now |
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Chip1Cloud | IC MODULAR ISDN NT INTELL MQFP64 | 2500 |
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RFQ |
Part Details for PSB21150HV1.4
PSB21150HV1.4 CAD Models
PSB21150HV1.4 Part Data Attributes
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PSB21150HV1.4
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
PSB21150HV1.4
Infineon Technologies AG
Telecom Circuit,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | MQFP-64 | |
Reach Compliance Code | compliant | |
JESD-30 Code | S-PQFP-G64 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | 220 | |
Seated Height-Max | 2.45 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.8 mm | |
Terminal Position | QUAD | |
Width | 14 mm |