Datasheets
QH25F640S33B8 by:

Flash, 8MX8, PDSO16

Part Details for QH25F640S33B8 by Micron Technology Inc

Overview of QH25F640S33B8 by Micron Technology Inc

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Part Details for QH25F640S33B8

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QH25F640S33B8 Part Data Attributes

QH25F640S33B8 Micron Technology Inc
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QH25F640S33B8 Micron Technology Inc Flash, 8MX8, PDSO16
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description SOP, SOP16,.4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block BOTTOM
Clock Frequency-Max (fCLK) 68 MHz
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G16
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 8
Number of Terminals 16
Number of Words 8388608 words
Number of Words Code 8000000
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP16,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00007 A
Supply Current-Max 0.045 mA
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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