Part Details for R1LV0216BSB-5SI#B1 by Renesas Electronics Corporation
Results Overview of R1LV0216BSB-5SI#B1 by Renesas Electronics Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
R1LV0216BSB-5SI#B1 Information
R1LV0216BSB-5SI#B1 by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for R1LV0216BSB-5SI#B1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
66AH6950
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Newark | Lpsram, 2Mbit, -40 To 85Deg C Rohs Compliant: Yes |Renesas R1LV0216BSB-5SI#B1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 200 |
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$0.1860 | Buy Now |
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DISTI #
R1LV0216BSB-5SI#B1
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Avnet Americas | - Trays (Alt: R1LV0216BSB-5SI#B1) COO: Japan RoHS: Compliant Min Qty: 135 Package Multiple: 135 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$2.1965 / $2.2077 | Buy Now |
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DISTI #
R1LV0216BSB-5SI#B1
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Avnet Silica | (Alt: R1LV0216BSB-5SI#B1) RoHS: Compliant Min Qty: 25 Package Multiple: 25 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
R1LV0216BSB-5SI#B1
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Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray | 200 |
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$2.8100 | Buy Now |
US Tariff Estimator: R1LV0216BSB-5SI#B1 by Renesas Electronics Corporation
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for R1LV0216BSB-5SI#B1
R1LV0216BSB-5SI#B1 CAD Models
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R1LV0216BSB-5SI#B1 Part Data Attributes
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R1LV0216BSB-5SI#B1
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
R1LV0216BSB-5SI#B1
Renesas Electronics Corporation
2Mb Advanced LPSRAM (128k word x 16bit), TSOP(44), /Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TSOP(44) | |
| Package Description | TSOP2, TSOP44,.46,32 | |
| Pin Count | 44 | |
| Manufacturer Package Code | PTSB0044GH | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G44 | |
| Length | 18.41 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 44 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX16 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP2 | |
| Package Equivalence Code | TSOP44,.46,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00001 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | DUAL | |
| Width | 10.16 mm |
Alternate Parts for R1LV0216BSB-5SI#B1
This table gives cross-reference parts and alternative options found for R1LV0216BSB-5SI#B1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of R1LV0216BSB-5SI#B1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| R1LV0216BSB-5SI#S0 | Renesas Electronics Corporation | Check for Price | 2Mb Advanced LPSRAM (128k word x 16bit), TSOP(44), /Embossed Tape | R1LV0216BSB-5SI#B1 vs R1LV0216BSB-5SI#S0 |
R1LV0216BSB-5SI#B1 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance would involve placing the IC near a thermal pad or a heat sink, ensuring good airflow, and using thermal vias to dissipate heat efficiently.
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To handle ESD protection, use ESD protection diodes or TVS diodes on the input/output pins, and ensure that the PCB design includes ESD protection circuits. Additionally, follow proper handling and storage procedures to prevent ESD damage.
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The power sequencing requirements for R1LV0216BSB-5SI#B1 typically involve powering up the device in a specific order, such as powering up the analog supply before the digital supply. Refer to the datasheet for specific power-up sequencing requirements.
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To troubleshoot issues, start by verifying the power supply and clock signals, then check the input/output signals and verify that they are within the specified operating ranges. Use oscilloscopes or logic analyzers to debug the issue, and consult the datasheet and application notes for guidance.
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Thermal design considerations include ensuring good airflow, using thermal pads or heat sinks, and optimizing the PCB layout for heat dissipation. The device's thermal resistance (θJA) and junction temperature (TJ) ratings should also be considered.