Datasheets
S1C6S3N2D by:

4-BIT, MROM, 0.032MHz, MICROCONTROLLER, UUC79, DIE-79

Part Details for S1C6S3N2D by Epson Electronics America Inc

Overview of S1C6S3N2D by Epson Electronics America Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for S1C6S3N2D

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S1C6S3N2D Part Data Attributes

S1C6S3N2D Epson Electronics America Inc
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S1C6S3N2D Epson Electronics America Inc 4-BIT, MROM, 0.032MHz, MICROCONTROLLER, UUC79, DIE-79
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SEIKO EPSON CORP
Part Package Code DIE
Package Description DIE,
Pin Count 79
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Has ADC NO
Additional Feature DEVICE IS ALSO AVAILABLE IN A 80 PIN SQUARE QFP14 PACKAGE; OPERATES WITH A -1.8V TO -3.6V SUPPLY
Address Bus Width
Bit Size 4
Clock Frequency-Max 0.032 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-XUUC-N79
Number of I/O Lines 21
Number of Terminals 79
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
PWM Channels NO
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
ROM Programmability MROM
Speed 0.032 MHz
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Form NO LEAD
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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