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Logic / Gates / SN74HC132DBRG4
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SN74HC132DBRG4 by: Texas Instruments
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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on FindChips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Learn more
Parametric Data

Part Details for: SN74HC132DBRG4

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Part Details

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on FindChips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Learn more

Alternate Parts for: SN74HC132DBRG4

Functional Equivalents (10)
Part Number Description Manufacturer Compare
M38510/65005BCA Logic NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14, CERAMIC, DIP-14 Defense Logistics Agency SN74HC132DBRG4 vs M38510/65005BCA
CD54HC132F/3 Logic Gate RCA SN74HC132DBRG4 vs CD54HC132F/3
HD74HC132RPEL Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 3.95 X 8.65 MM, 1.27 MM PITCH, PLASTIC, SOP-14 Renesas Electronics Corporation SN74HC132DBRG4 vs HD74HC132RPEL
935185800118 Logic IC HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, SOT-402-1, TSSOP-14, Gate NXP Semiconductors SN74HC132DBRG4 vs 935185800118
MC74HC132AN Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 onsemi SN74HC132DBRG4 vs MC74HC132AN
MM74HC132MTC Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, TSSOP-14 Texas Instruments SN74HC132DBRG4 vs MM74HC132MTC
GD74HCT00 Logic NAND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDIP14, Goldstar Electron Co Ltd SN74HC132DBRG4 vs GD74HCT00
MC74HC132AND Logic IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC Freescale Semiconductor SN74HC132DBRG4 vs MC74HC132AND
MM74HC132MX_NL Logic NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, PDSO14, 0.150 INCH, LEAD FREE, MS-012, SOIC-14 Fairchild Semiconductor Corporation SN74HC132DBRG4 vs MM74HC132MX_NL
SNV54HC132J Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 Texas Instruments SN74HC132DBRG4 vs SNV54HC132J

Resources and Additional Insights

Reference Designs

  • Modular Smart Meter Reference Design for Evaluating Communications Technologies
    TIDM-SMARTMETERMSP430: The Smart Meter Board (SMB) 2.5 is a modular development platform incorporating key TI Smart Grid. The SMB makes it simpler for developers to compare different TI communications solutions to determine which options are the best fit for their application by replacing different add-in cards to evaluate various Smart Grid communications options including ZigBee®, sub-1GHz wireless, and power line communications. The SMB includes the MSP430FF47197 SoC to perform three-phase energy measurement and act as the system host processor. TI provides the necessary energy measurement software and drivers to interface with the communications add-on cards to make the evaluation process simpler.

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