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SN74HC132PWLE by: Texas Instruments

Overview of: SN74HC132PWLE by Texas Instruments

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Part Details for: SN74HC132PWLE

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Part Details

Parametric Data

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: SN74HC132PWLE

Part Number Description Manufacturer Compare
935298738118 Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 Nexperia SN74HC132PWLE vs 935298738118
74HC132PW-Q100,118 Logic 74HC132-Q100; 74HCT132-Q100 - Quad 2-input NAND Schmitt trigger@en-us TSSOP 14-Pin Nexperia SN74HC132PWLE vs 74HC132PW-Q100,118
SN74HC132PWTE4 Logic Quadruple Positive-NAND Gates With Schmitt-Trigger Inputs 14-TSSOP -40 to 85 Texas Instruments SN74HC132PWLE vs SN74HC132PWTE4
SN74HC132PW Logic 4-ch, 4-input, 2-V to 6-V NAND gates with Schmitt-Trigger inputs 14-TSSOP -40 to 85 Texas Instruments SN74HC132PWLE vs SN74HC132PW
Part Number Description Manufacturer Compare
M74HC132RM13TR Logic Quad 2-Input Schmitt NAND Gate STMicroelectronics SN74HC132PWLE vs M74HC132RM13TR
74HC132PW-Q100,118 Logic 74HC132-Q100; 74HCT132-Q100 - Quad 2-input NAND Schmitt trigger@en-us TSSOP 14-Pin Nexperia SN74HC132PWLE vs 74HC132PW-Q100,118
MC74HCT00AN Logic NAND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDIP14, PLASTIC, DIP-14 Motorola Semiconductor Products SN74HC132PWLE vs MC74HCT00AN
MC74HC132ADDR2 Logic NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, PDSO14, SOIC-14 Motorola Semiconductor Products SN74HC132PWLE vs MC74HC132ADDR2
CD54HCT00F3A Logic IC,LOGIC GATE,QUAD 2-INPUT NAND,HCT-CMOS,DIP,14PIN,CERAMIC Intersil Corporation SN74HC132PWLE vs CD54HCT00F3A
DV74HCT00AN Logic NAND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDIP14, PLASTIC, DIP-14 avg Semiconductors SN74HC132PWLE vs DV74HCT00AN
74HC132N,652 Logic 74HC132N NXP Semiconductors SN74HC132PWLE vs 74HC132N,652

Resources and Additional Insights

Reference Designs

  • Modular Smart Meter Reference Design for Evaluating Communications Technologies
    TIDM-SMARTMETERMSP430: The Smart Meter Board (SMB) 2.5 is a modular development platform incorporating key TI Smart Grid. The SMB makes it simpler for developers to compare different TI communications solutions to determine which options are the best fit for their application by replacing different add-in cards to evaluate various Smart Grid communications options including ZigBee®, sub-1GHz wireless, and power line communications. The SMB includes the MSP430FF47197 SoC to perform three-phase energy measurement and act as the system host processor. TI provides the necessary energy measurement software and drivers to interface with the communications add-on cards to make the evaluation process simpler.

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