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Logic / Gates / SN74HC132PWTE4
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SN74HC132PWTE4 by: Texas Instruments
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Purchasing Insights: SN74HC132PWTE4

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Estimated Price History

Nov 2020 - Present Past 6 Months

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on FindChips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Learn more
Parametric Data

Part Details for: SN74HC132PWTE4

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Part Details

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on FindChips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Learn more

Alternate Parts for: SN74HC132PWTE4

Functional Equivalents (10)
Part Number Description Manufacturer Compare
MC74HC132ADR2 Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SOIC-14 Motorola Mobility LLC SN74HC132PWTE4 vs MC74HC132ADR2
GD74HCT132J Logic NAND Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14, Goldstar Electron Co Ltd SN74HC132PWTE4 vs GD74HCT132J
SN74HC132DTG4 Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14 Texas Instruments SN74HC132PWTE4 vs SN74HC132DTG4
CD74HCT132ME4 Logic HCT SERIES, QUAD 2-INPUT NAND GATE, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14 Texas Instruments SN74HC132PWTE4 vs CD74HCT132ME4
5962-8683101CA Logic IC HCT SERIES, QUAD 2-INPUT NAND GATE, CDIP, FRIT SEALED, CERDIP-14, Gate Defense Supply Center Columbus SN74HC132PWTE4 vs 5962-8683101CA
SN74HC132ADBRE4 Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, SSOP-14 Texas Instruments SN74HC132PWTE4 vs SN74HC132ADBRE4
MM54HC132J Logic IC HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate National Semiconductor Corporation SN74HC132PWTE4 vs MM54HC132J
SN74HC132D-00 Logic HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14 Texas Instruments SN74HC132PWTE4 vs SN74HC132D-00
74HCT132D,653 Logic 74HC(T)132 - Quad 2-input NAND Schmitt trigger SOIC 14-Pin NXP Semiconductors SN74HC132PWTE4 vs 74HCT132D,653
MM74HC132J Logic IC HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERDIP-14, Gate National Semiconductor Corporation SN74HC132PWTE4 vs MM74HC132J

Resources and Additional Insights

Reference Designs

  • Modular Smart Meter Reference Design for Evaluating Communications Technologies
    TIDM-SMARTMETERMSP430: The Smart Meter Board (SMB) 2.5 is a modular development platform incorporating key TI Smart Grid. The SMB makes it simpler for developers to compare different TI communications solutions to determine which options are the best fit for their application by replacing different add-in cards to evaluate various Smart Grid communications options including ZigBee®, sub-1GHz wireless, and power line communications. The SMB includes the MSP430FF47197 SoC to perform three-phase energy measurement and act as the system host processor. TI provides the necessary energy measurement software and drivers to interface with the communications add-on cards to make the evaluation process simpler.

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