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SN74LVC1G125DBVR by: Texas Instruments
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View this part on Newark 0 3,000 TAPE & REEL FULL
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View this part on Bristol Electronics 995 1
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Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

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Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

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Part Details for: SN74LVC1G125DBVR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: SN74LVC1G125DBVR

Part Number Description Manufacturer Compare
SN74LVC1G125DBVT Logic Single 1.65-V to 5.5-V buffer with 3-state outputs 5-SOT-23 -40 to 125 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G125DBVT
74LVC1G125DBVRG4 Logic Single 1.65-V to 5.5-V buffer with 3-state outputs 5-SOT-23 -40 to 125 Texas Instruments SN74LVC1G125DBVR vs 74LVC1G125DBVRG4
SN74LVC1G125DBVTG4 Logic LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G125DBVTG4
Part Number Description Manufacturer Compare
SN74LVC1G126DBV Logic LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G126DBV
SN74LVC1G125DBVTG4 Logic LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G125DBVTG4
74AHC1G126SE-7 Logic Bus Driver, AHC/VHC/H/U/V Series, 1-Func, 1-Bit, True Output, CMOS, PDSO5, GREEN, SOT-353, 5 PIN Diodes Incorporated SN74LVC1G125DBVR vs 74AHC1G126SE-7
SN74LVC1G125DBVT Logic Single 1.65-V to 5.5-V buffer with 3-state outputs 5-SOT-23 -40 to 125 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G125DBVT
SN74LVC1G125DSFR Logic Single 1.65-V to 5.5-V buffer with 3-state outputs 6-SON -40 to 125 Texas Instruments SN74LVC1G125DBVR vs SN74LVC1G125DSFR
74LVC1G125DBVRG4 Logic Single 1.65-V to 5.5-V buffer with 3-state outputs 5-SOT-23 -40 to 125 Texas Instruments SN74LVC1G125DBVR vs 74LVC1G125DBVRG4
74AHC1G125SE-7 Logic Bus Driver, AHC/VHC/H/U/V Series, 1-Func, 1-Bit, True Output, CMOS, PDSO5, GREEN, SOT-353, 5 PIN Diodes Incorporated SN74LVC1G125DBVR vs 74AHC1G125SE-7

Resources and Additional Insights

Reference Designs

  • TIDA-00254 Accurate Point Cloud Generation for 3D Machine Vision Applications using DLP® Technology | TI.com
    TIDA-00254: The 3D Machine Vision reference design employs Texas Instruments DLP® Advanced Light Control Software Development Kit (SDK) for LightCrafter™ series controllers, which allows developers to easily construct 3D point clouds by integrating TI’s digital micromirror device (DMD) technology with cameras, sensors, motors or other peripherals. The highly differentiated 3D Machine Vision system utilizes the DLP® LightCrafter™ 4500 evaluation module (EVM), featuring the DLP4500 WXGA chipset, and enables flexible control of high resolution, accurate patterns for industrial, medical, and security applications.
  • TIDA-01015 4 GHz Clock Reference Design for 12 Bit High Speed ADCs in Digital Oscilloscopes & Wireless Testers | TI.com
    TIDA-01015: The TIDA-01015 is a clocking solution reference design for high speed direct RF sampling GSPS ADCs. This design showcases the significance of the sampling clock to achieve high SNR for 2nd Nyquist zone input signal frequencies. ADC12J4000 is a 12-bit, 4-GSPS RF sampling ADC with 3-dB input bandwidth of 3.2 GHz capable of capturing signals up to 4 GHz. This design highlights a clocking solution for the ADC12J4000 using TRF3765, to achieve high SNR performance at high input frequencies used in applications such as digital storage oscilloscopes (DSO) and wireless testers.
  • Daisy chain temperature sensor reference design for SensorTag
    TIDA-00800: The TIDA-00800 reference design entails 4 temperature sensors along a daisy chain in a cabling environment. The sensors connect to the SensorTag development platform via the UART interface where the information can be transmitted wirelessly. The Bluetooth low energy wireless technology makes testing and demonstration easier due to its integration in most modern equipment. The form factor and electrical connections are compatible with TI SensorTag 2.0 ecosystem, allowing easy prototyping with other wireless technology (Zigbee, Wifi, sub 1GHz…), while the selected sensor allows industrial grade accuracy and resolution.
  • High Resolution, Portable Light Steering Reference Design using DLP Technology
    DLP4500-C350REF: This reference design, featuring the DLP® 0.45” WXGA chipset and implemented in the DLP® LightCrafter™ 4500 evaluation module (EVM), enables flexible control of high resolution, accurate patterns for industrial, medical, and scientific applications. With a free USB-based GUI and API, developers can easily integrate TI’s innovative digital micromirror device (DMD) technology with cameras, sensors, motors, and other peripherals to create highly differentiated 3D machine vision systems, 3D printers, and augmented reality displays.
  • RF Sampling 4-GSPS ADC Reference Design with 8-GHz DC-Coupled Differential Amplifier
    TIDA-00431: Wideband radio frequency (RF) receivers allow greatly increased flexibility in radio designs. The wide instantaneous bandwidth allows flexible tuning without changing hardware and the ability to capture multiple channels at widely separated frequencies. This reference design describes a wideband RF receiver utilizing a 4-GSPS analog-to-digital converter (ADC), with an 8-GHz, DC-coupled, fully differential amplifier front end. The amplifier front end provides signal gain and allows capture of signals down to DC, which is not possible with a balun-coupled input.
  • DLP Ultra-mobile NIR Spectrometer for Portable Chemical Analysis with Bluetooth Connectivity
    TIDA-00554: The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs array detector or fragile rotating grating architectures. The reference design supports Bluetooth low energy to enable mobile lab measurements for hand-held spectrometers for applications including food, agriculture, pharmaceuticals, petrochemicals, and more. Using a TI Tiva processor, databases in the cloud can be leveraged through cellular networks for real-time lab equivalent analytics, which allow food or skin analysis and wearable health monitor solutions. Developers can also create their own data collection and analysis through innovative iOS and Android applications.
  • TIDA-00554 DLP Ultra-mobile NIR Spectrometer for Portable Chemical Analysis with Bluetooth Connectivity | TI.com
    TIDA-00554: The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs array detector or fragile rotating grating architectures. The reference design supports Bluetooth low energy to enable mobile lab measurements for hand-held spectrometers for applications including food, agriculture, pharmaceuticals, petrochemicals, and more. Using a TI Tiva processor, databases in the cloud can be leveraged through cellular networks for real-time lab equivalent analytics, which allow food or skin analysis and wearable health monitor solutions. Developers can also create their own data collection and analysis through innovative iOS and Android applications.
  • DLP4500-C350REF High Resolution, Portable Light Steering Reference Design using DLP Technology | TI.com
    DLP4500-C350REF: This reference design, featuring the DLP® 0.45” WXGA chipset and implemented in the DLP® LightCrafter™ 4500 evaluation module (EVM), enables flexible control of high resolution, accurate patterns for industrial, medical, and scientific applications. With a free USB-based GUI and API, developers can easily integrate TI’s innovative digital micromirror device (DMD) technology with cameras, sensors, motors, and other peripherals to create highly differentiated 3D machine vision systems, 3D printers, and augmented reality displays.
  • TIDA-00609 Self-Booting Audio System | TI.com
    TIDA-00609: The purpose of this TI Design is to provide the designer hardware and software tools that can be used as reference for audio systems. The new revision of the PurePath™ Console Motherboard (RevF) adds stand-alone, self-booting capabilities to allow making compelling demos with any EVM that is compatible with this platform.
  • TIDA-00800 Daisy chain temperature sensor reference design for SensorTag | TI.com
    TIDA-00800: The TIDA-00800 reference design entails 4 temperature sensors along a daisy chain in a cabling environment. The sensors connect to the SensorTag development platform via the UART interface where the information can be transmitted wirelessly. The Bluetooth low energy wireless technology makes testing and demonstration easier due to its integration in most modern equipment. The form factor and electrical connections are compatible with TI SensorTag 2.0 ecosystem, allowing easy prototyping with other wireless technology (Zigbee, Wifi, sub 1GHz…), while the selected sensor allows industrial grade accuracy and resolution.
  • 8 Channel 1A/Ch High Side Driver for Programmable Logic Controller (PLC) Reference Design
    TIDA-00183: The TIDA-00183 shows a high density, high power digital output circuitry with full protection and isolation for programmable logic controllers in factory automation and control environment. The BeagleBone-Black cape formfactor allows easy evaluation of the used driver chips and the interoperation with an MSP430 MCU for innovative protection schemes.
  • TIDA-00550 Dual Channel-to-Channel Isolated Universal Analog Input Module for PLC Reference Design | TI.com
    TIDA-00550: The TIDA-00550, dual channel-to-channel isolated universal analog input module reference design for programmable logic controllers (PLC), combines precision and flexibility. This TI Design used in conjunction with sensor transmitters can measure standard input voltages and currents as well as thermocouples, RTD and 4-20mA loops. With only four input terminals, it is suited for applications where smallest real-estate, high versatility and performance is required at the same time.
  • TIDEP0059 G3-PLC (CENELEC Band) Data Concentrator Reference Design | TI.com
    TIDEP0059: The TIDEP0059 reference design implements a complete Power Line Communications (PLC) Data Concentrator based upon the G3-PLC industry standard. It operates in the 36 kHz – 91 kHz band defined by the CENELEC for Smart Grid communications. The reference design includes G3-PLC software which supports the management of up to 1000 G3-PLC end points in a neighborhood area network. The reference design supports the full 312 Kbps data throughput specified by the G3-PLC standard.
  • TIDA-00431 RF Sampling 4-GSPS ADC Reference Design with 8-GHz DC-Coupled Differential Amplifier | TI.com
    TIDA-00431: Wideband radio frequency (RF) receivers allow greatly increased flexibility in radio designs. The wide instantaneous bandwidth allows flexible tuning without changing hardware and the ability to capture multiple channels at widely separated frequencies. This reference design describes a wideband RF receiver utilizing a 4-GSPS analog-to-digital converter (ADC), with an 8-GHz, DC-coupled, fully differential amplifier front end. The amplifier front end provides signal gain and allows capture of signals down to DC, which is not possible with a balun-coupled input.
  • TIDA-01017 High Speed Multi-Channel ADC Clock Reference Design for Oscilloscopes, Wireless Testers and Radars | TI.com
    TIDA-01017: The TIDA-01017 reference design demonstrates the performance of a clocking solution for a high speed multi-channel system, analyzed by measuring the channel to channel skew for the entire input frequency range of the RF sampling ADC. Channel to channel skew is critical for phased array radar and oscilloscope applications. The ADC12J4000 is a low power, 12-bit, 4-GSPS RF-sampling analog to digital converter (ADC) with a buffered analog input, integrated digital down Converter, features a JESD204B interface, and it captures signals up to 4GHz. This design showcases the clocking solution using the LMK04828, to achieve the synchronization between multiple ADC12J4000 signal chains using synchronized SYSREF.
  • TIDEP0058 G3-PLC (FCC Band) Data Concentrator Reference Design | TI.com
    TIDEP0058: The TIDEP0058 reference design implements a complete Power Line Communications (PLC) Data Concentrator based upon the G3-PLC industry standard. It operates in the 157 kHz – 487 kHz band defined by the FCC for Smart Grid communications. The reference design includes G3-PLC software which supports the management of up to 1000 G3-PLC end points in a neighborhood area network. The reference design supports the full 312 Kbps data throughput specified by the G3-PLC standard.
  • TIDA-00183 8 Channel 1A/Ch High Side Driver for Programmable Logic Controller (PLC) Reference Design | TI.com
    TIDA-00183: The TIDA-00183 shows a high density, high power digital output circuitry with full protection and isolation for programmable logic controllers in factory automation and control environment. The BeagleBone-Black cape formfactor allows easy evaluation of the used driver chips and the interoperation with an MSP430 MCU for innovative protection schemes.
  • Self-Booting Audio System
    TIDA-00609: The purpose of this TI Design is to provide the designer hardware and software tools that can be used as reference for audio systems. The new revision of the PurePath™ Console Motherboard (RevF) adds stand-alone, self-booting capabilities to allow making compelling demos with any EVM that is compatible with this platform.
  • TIDA-00845 Two-Port Automotive USB 2.0 Hub With Short-to-Battery Protection Reference Design | TI.com
    TIDA-00845: TIDA-00845 is a dual-port USB 2.0 hub with the ability to withstand a short of up to 18-V DC on both downstream ports, as well as Level 4 IEC 61000-4-2 ESD protection, overcurrent conditions, and shorts to ground. This protection is provided by an integrated protection device - the TPD3S714-Q1. With short-to-battery (STB) protection, short-circuit protection, and a fixed current-limit load switch on both downstream ports, the TUSB4020BI USB 2.0 hub is isolated and protected from overvoltage and overcurrent conditions. Downstream port 1 includes a STB test simulator for applying 18-V DC, and two TPD3S714-Q1s to protect both the hub and a peripheral for easily demonstrating USB STB protection functionality.
  • TIDA-00448 Flexible High Current IGBT Gate Driver with Reinforced Digital Isolator Reference Design | TI.com
    TIDA-00448: The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used for multiple drive platforms with different power ratings. A Digital isolator is used to achieve reinforced isolation with transient surge rating of 8kV and 50kV CMTI. The design incorporates DESAT protection using a fast transient response comparator. The DESAT detection threshold and the soft turn-off time are configurable. The design can interface with PWMs from 3.3 V and 5 V MCUs along with fault, reset and UVLO feedbacks.
  • Accurate Point Cloud Generation for 3D Machine Vision Applications using DLP® Technology
    TIDA-00254: The 3D Machine Vision reference design employs Texas Instruments DLP Software Development Kit (SDK) allowing developers to easily construct 3D point clouds by integrating TI’s digital micromirror device (DMD) technology with cameras, sensors, motors or other peripherals. The highly differentiated 3D Machine Vision systems utilizes the DLP® LightCrafter™ 4500 evaluation module (EVM), featuring the DLP® 0.45” WXGA chipset, and enables flexible control of high resolution, accurate patterns for industrial, medical, and security applications.
  • Flexible High Current IGBT Gate Driver with Reinforced Digital Isolator Reference Design
    TIDA-00448: The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used for multiple drive platforms with different power ratings. A Digital isolator is used to achieve reinforced isolation with transient surge rating of 8kV and 50kV CMTI. The design incorporates DESAT protection using a fast transient response comparator. The DESAT detection threshold and the soft turn-off time are configurable. The design can interface with PWMs from 3.3 V and 5 V MCUs along with fault, reset and UVLO feedbacks.
  • TIDEP0078 OPC UA Data Access Server for AM572x Reference Design | TI.com
    TIDEP0078: OPC UA is an industrial machine-to-machine protocol designed to allow interoperability and communication between all machines connected under Industry 4.0. The TIDEP0078 TI Design demonstrates use of the MatrikonOPC™ OPC UA server development kit (SDK) to allow communications using an OPC UA data access (DA) server running embedded in a project or design. The OPC UA DA deals with real-time data and is best suited for industrial automation applications where time is an important aspect of the data. A reference OPC UA server implementation is provided that accesses the GPIO capabilities of the AM572x IDK. The reference code can be extended to provide an OPC UA interface to any data the AM572x IDK board can access including data acquired through Profibus, RS-485, CAN bus, and industrial Ethernet-based protocols such as EtherCAT™ or PROFINET™ using the Programmable Real-time Unit Industrial Communication Subsystems (PRU-ICSS).

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