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SN74LVC1T45DCKR

Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SC70 -40 to 85

Manufacturer Texas Instruments
Price Range $0.1716 / $0.7370

Part Details

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Distributors with Stock

Part Number Description Manufacturer Compare
SN74LVC1T45DCKRG4 Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SC70 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DCKRG4
SN74LVC1T45MDCKREP Logic Enhanced Product Single-Bit Dual-Supply Bus Transc., Configurable Voltage Transl. , 3-State Outputs 6-SC70 -55 to 125 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45MDCKREP
SN74LVC1T45DCKT Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SC70 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DCKT
Part Number Description Manufacturer Compare
SN74LVC1T45DPKR Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-USON -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DPKR
SN74LVC1T45DBVR Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SOT-23 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DBVR
SN74LVC1T45YZPR Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-DSBGA -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45YZPR
SN74LVC1T45DRLRG4 Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SOT-5X3 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DRLRG4
SN74LVC1T45DRLR Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SOT-5X3 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DRLR
SN74LVC1T45DCKRG4 Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SC70 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DCKRG4
SN74LVC1T45DBVT Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SOT-23 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DBVT
SN74LVC1T45DBVRG4 Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SOT-23 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DBVRG4
SN74LVC1T45DCKT Logic Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 6-SC70 -40 to 85 Texas Instruments SN74LVC1T45DCKR vs SN74LVC1T45DCKT

Global Popularity

Popularity in Logic

Popularity in Bus Driver/Transceivers

Popularity by Region

Very High

Medium

Good

Low

  • 1. China
    100
  • 2. United States
    99
  • 3. South Korea
    86
  • 4. India
    76
  • 5. Taiwan
    75
  • 6. Lithuania
    75
  • 7. Russia
    74
  • 8. Canada
    74
  • 9. Germany
    72
  • 10. Denmark
    67

Estimated Price History

Estimated Stock History

Market Price Analysis

No data available
  • 1. Avnet Americas $0.1716 Buy Now
  • 2. element14 Asia-Pacific $0.2002 Buy Now
  • 3. Newark element14 $0.2530 Buy Now
  • 4. Texas Instruments $0.3800 Buy Now
  • 5. Newark element14 $0.5800 Buy Now
  • 6. Chip1Stop $0.7370 Buy Now

Datasheets & Reference Designs

Reference Designs

  • Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • Modular Smart Meter Reference Design for Evaluating Communications Technologies
    TIDM-SMARTMETERMSP430: The Smart Meter Board (SMB) 2.5 is a modular development platform incorporating key TI Smart Grid. The SMB makes it simpler for developers to compare different TI communications solutions to determine which options are the best fit for their application by replacing different add-in cards to evaluate various Smart Grid communications options including ZigBee®, sub-1GHz wireless, and power line communications. The SMB includes the MSP430FF47197 SoC to perform three-phase energy measurement and act as the system host processor. TI provides the necessary energy measurement software and drivers to interface with the communications add-on cards to make the evaluation process simpler.
  • TIDEP0047 Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design | TI.com
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • SimpleLink™ Wi-Fi® CC3200 Module LaunchPad
    TIDC-CC3200MODLAUNCHXL: The CC3200MODLAUNCHXL is a low-cost evaluation platform which hosts the CC3200MOD. The SimpleLink™ CC3200MOD is a wireless microcontroller (MCU) module that integrates an ARM® Cortex™-M4 based MCU, allowing customers to develop an entire application using a single device. The module LaunchPad also features programmable user buttons, RGB LED for custom applications, temperature and accelerometer sensors, as well as onboard emulation for debugging. The LaunchPad stackable headers interface demonstrates how to expand the functionality of the CC3200MOD when interfacing with other peripherals on existing BoosterPack add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.
  • Wide Bandwidth Optical Front-end Reference Design
    TIDA-00725: This reference design implements and measures a complete 120MHz wide bandwidth optical front end comprising a high speed transimpedance amplifier, fully differential amplifier, and high speed 14-bit 160MSPS ADC with JESD204B interface. Hardware and software are provided to evaluate the performance of the system in response to high speed optical pulses generated from the included laser driver and diode for applications including optical time domain reflectrometry (OTDR).
  • TIDC-CC3200MODLAUNCHXL SimpleLink™ Wi-Fi® CC3200 Module LaunchPad | TI.com
    TIDC-CC3200MODLAUNCHXL: The CC3200MODLAUNCHXL is a low-cost evaluation platform which hosts the CC3200MOD. The SimpleLink™ CC3200MOD is a wireless microcontroller (MCU) module that integrates an ARM® Cortex™-M4 based MCU, allowing customers to develop an entire application using a single device. The module LaunchPad also features programmable user buttons, RGB LED for custom applications, temperature and accelerometer sensors, as well as onboard emulation for debugging. The LaunchPad stackable headers interface demonstrates how to expand the functionality of the CC3200MOD when interfacing with other peripherals on existing BoosterPack add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.
  • TIDEP0046 Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design | TI.com
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • TIDA-00725 Wide Bandwidth Optical Front-end Reference Design | TI.com
    TIDA-00725: This reference design implements and measures a complete 120MHz wide bandwidth optical front end comprising a high speed transimpedance amplifier, fully differential amplifier, and high speed 14-bit 160MSPS ADC with JESD204B interface. Hardware and software are provided to evaluate the performance of the system in response to high speed optical pulses generated from the included laser driver and diode for applications including optical time domain reflectrometry (OTDR).

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