Part Details for SPC58NE84E7XMOAY by STMicroelectronics
Overview of SPC58NE84E7XMOAY by STMicroelectronics
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Part Details for SPC58NE84E7XMOAY
SPC58NE84E7XMOAY CAD Models
SPC58NE84E7XMOAY Part Data Attributes
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SPC58NE84E7XMOAY
STMicroelectronics
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Datasheet
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SPC58NE84E7XMOAY
STMicroelectronics
RISC Microcontroller, 32-Bit, FLASH, 180MHz, CMOS, PQFP176
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | LQFP-176 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2017-04-11 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | SPC58 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G176 | |
| Length | 24 mm | |
| Number of DMA Channels | 96 | |
| Number of Terminals | 176 | |
| Number of Timers | 156 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (bytes) | 622592 | |
| ROM (words) | 6438912 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 24 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |