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LOW POWER DDR3 Register + PLL, CABGA170/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
800-SSTE32882KB1AKG-ND
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DigiKey | CABGA 13.50X8.00X1.10 MM, 0.65MM Min Qty: 340 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$3.7370 | Buy Now |
DISTI #
SSTE32882KB1AKG
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Avnet Americas | Registering Clock Driver with Parity Test and Quad Chip Select 1.25V/1.35V/1.5V 220-Ball FPBGA Tray - Trays (Alt: SSTE32882KB1AKG) RoHS: Compliant Min Qty: 340 Package Multiple: 170 Lead time: 26 Weeks, 1 Days Container: Tray | 0 |
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$2.5400 / $2.9000 | Buy Now |
DISTI #
972-SSTE32882KB1AKG
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Mouser Electronics | Clock Drivers & Distribution LOW POWER DDR3 Register + PLL RoHS: Compliant | 0 |
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$3.1100 / $3.6600 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 340 Package Multiple: 170 Lead time: 18 Weeks Container: Tray | 0Tray |
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$2.4400 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 340 Package Multiple: 170 Lead time: 18 Weeks Container: Tray | 0Tray |
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$2.4400 | Buy Now |
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SSTE32882KB1AKG
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
SSTE32882KB1AKG
Renesas Electronics Corporation
LOW POWER DDR3 Register + PLL, CABGA170/Tray
|
Pbfree Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Package Description | FBGA, BGA176,11X20,25 | |
Pin Count | 176 | |
Manufacturer Package Code | AKG176 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 26 Weeks, 1 Day | |
Samacsys Manufacturer | Renesas Electronics | |
JESD-30 Code | R-PBGA-B176 | |
JESD-609 Code | e1 | |
Logic IC Type | PLL BASED CLOCK DRIVER | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 176 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA176,11X20,25 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Packing Method | TRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.635 mm | |
Terminal Position | BOTTOM |
This table gives cross-reference parts and alternative options found for SSTE32882KB1AKG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SSTE32882KB1AKG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
SSTE32882KB1AKG8 | LOW POWER DDR3 Register + PLL, CABGA0/Reel | Renesas Electronics Corporation | SSTE32882KB1AKG vs SSTE32882KB1AKG8 |