Part Details for SSTUA32864EC/G,557 by NXP Semiconductors
Overview of SSTUA32864EC/G,557 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for SSTUA32864EC/G,557
SSTUA32864EC/G,557 CAD Models
SSTUA32864EC/G,557 Part Data Attributes
|
|
SSTUA32864EC/G,557
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
SSTUA32864EC/G,557
NXP Semiconductors
SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA96,6X16,32 | |
| Pin Count | 96 | |
| Manufacturer Package Code | SOT536-1 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Family | SSTU | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Logic IC Type | D FLIP-FLOP | |
| Moisture Sensitivity Level | 2 | |
| Number of Bits | 25 | |
| Number of Functions | 1 | |
| Number of Terminals | 96 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA96,6X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Propagation Delay (tpd) | 1.8 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Trigger Type | POSITIVE EDGE | |
| Width | 5.5 mm | |
| fmax-Min | 450 MHz |
Alternate Parts for SSTUA32864EC/G,557
This table gives cross-reference parts and alternative options found for SSTUA32864EC/G,557. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SSTUA32864EC/G,557, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| SSTUA32864EC | IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96, FF/Latch | NXP Semiconductors | SSTUA32864EC/G,557 vs SSTUA32864EC |
| SSTUA32864EC/G | IC SSTU SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96, FF/Latch | NXP Semiconductors | SSTUA32864EC/G,557 vs SSTUA32864EC/G |
| SSTUA32864EC,557 | SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications | NXP Semiconductors | SSTUA32864EC/G,557 vs SSTUA32864EC,557 |
| SSTUA32864EC/G,518 | SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications | NXP Semiconductors | SSTUA32864EC/G,557 vs SSTUA32864EC/G,518 |
| SSTUA32864EC,518 | SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications | NXP Semiconductors | SSTUA32864EC/G,557 vs SSTUA32864EC,518 |