Part Details for T1024NSE7KNA by NXP Semiconductors
Overview of T1024NSE7KNA by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for T1024NSE7KNA
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51Y5672
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Newark | Qoriq, 2Xcpu 64-Bit Pwr Arch, 1.0Ghz, Ddr3L/4, Pcie, 1/10Gbe, Hw Accel, Sec, 0 To 105C, 23X23 Pkg/ Tray Rohs Compliant: Yes |Nxp T1024NSE7KNA RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$77.9400 / $82.8100 | Buy Now |
DISTI #
T1024NSE7KNA-ND
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DigiKey | IC MPU QORIQ T1 1GHZ 780FBGA Min Qty: 60 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$76.1070 | Buy Now |
DISTI #
T1024NSE7KNA
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Avnet Americas | MPU QorIQ RISC 64-Bit 1000MHz 780-Pin FCPBGA Tray - Trays (Alt: T1024NSE7KNA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
841-T1024NSE7KNA
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Mouser Electronics | Microprocessors - MPU QorIQ, 2xCPU 64-Bit Pwr Arch, 1.0GHz, DDR3L/4, PCIe, 1/10GbE, HW Accel, SEC, 0 to 105C, 23x23 pkg RoHS: Compliant | 0 |
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$89.5300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks Container: Tray | 0Tray |
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$76.1100 | Buy Now |
DISTI #
T1024NSE7KNA
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EBV Elektronik | MPU QorIQ RISC 64-Bit 1000MHz 780-Pin FCPBGA Tray (Alt: T1024NSE7KNA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 20 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 417 |
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RFQ |
Part Details for T1024NSE7KNA
T1024NSE7KNA CAD Models
T1024NSE7KNA Part Data Attributes
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T1024NSE7KNA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
T1024NSE7KNA
NXP Semiconductors
64-BIT, 1000MHz, RISC PROCESSOR, PBGA780
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HFBGA, BGA780,28X28,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 18 Weeks | |
JESD-30 Code | S-PBGA-B780 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 780 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFBGA | |
Package Equivalence Code | BGA780,28X28,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Seated Height-Max | 2.07 mm | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 0.97 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | SoC |