Part Details for TC58FVB641XB-10 by Toshiba America Electronic Components
Overview of TC58FVB641XB-10 by Toshiba America Electronic Components
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for TC58FVB641XB-10
TC58FVB641XB-10 CAD Models
TC58FVB641XB-10 Part Data Attributes
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TC58FVB641XB-10
Toshiba America Electronic Components
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Datasheet
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TC58FVB641XB-10
Toshiba America Electronic Components
IC 4M X 16 FLASH 3V PROM, 100 ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, TFBGA-63, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | 9 X 11 MM, 0.80 MM PITCH, TFBGA-63 | |
| Pin Count | 63 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 100 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 8,127 | |
| Number of Terminals | 63 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA63,8X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.2 mm | |
| Sector Size | 8K,64K | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.045 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 9 mm |
Alternate Parts for TC58FVB641XB-10
This table gives cross-reference parts and alternative options found for TC58FVB641XB-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC58FVB641XB-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NAND01GW4A1DZA6 | Flash, 64MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 | Numonyx Memory Solutions | TC58FVB641XB-10 vs NAND01GW4A1DZA6 |
| NAND01GW4A3BZA1E | Flash, 64MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 | Numonyx Memory Solutions | TC58FVB641XB-10 vs NAND01GW4A3BZA1E |
| NAND01GW4A3DZA1E | Flash, 64MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 | Numonyx Memory Solutions | TC58FVB641XB-10 vs NAND01GW4A3DZA1E |
| NAND01GW4A0BZB6 | Flash, 64MX16, 35ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 | Numonyx Memory Solutions | TC58FVB641XB-10 vs NAND01GW4A0BZB6 |
| AM29LV640MB100RWHI | Flash, 4MX16, 100ns, PBGA63, 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | AMD | TC58FVB641XB-10 vs AM29LV640MB100RWHI |
| AM29DL640D120WHF | Flash, 4MX16, 120ns, PBGA63, 12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 | Spansion | TC58FVB641XB-10 vs AM29DL640D120WHF |
| S29GL064M10BAIR43 | Flash, 4MX16, 100ns, PBGA63, 12 X 11 MM, FBGA-63 | Spansion | TC58FVB641XB-10 vs S29GL064M10BAIR43 |
| AM29LV640DU121RWHK | Flash, 4MX16, 120ns, PBGA63, 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | Spansion | TC58FVB641XB-10 vs AM29LV640DU121RWHK |
| MX29LV640BBXBI-90G | Flash, 4MX16, 90ns, PBGA63, 11 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-210, CSP-63 | Macronix International Co Ltd | TC58FVB641XB-10 vs MX29LV640BBXBI-90G |
| NAND01GW4A1AZB1T | Flash, 64MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63 | Numonyx Memory Solutions | TC58FVB641XB-10 vs NAND01GW4A1AZB1T |