Part Details for TC75S101FU(TE85L,F) by Toshiba America Electronic Components
Overview of TC75S101FU(TE85L,F) by Toshiba America Electronic Components
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
Part Details for TC75S101FU(TE85L,F)
TC75S101FU(TE85L,F) CAD Models
TC75S101FU(TE85L,F) Part Data Attributes
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TC75S101FU(TE85L,F)
Toshiba America Electronic Components
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TC75S101FU(TE85L,F)
Toshiba America Electronic Components
IC,OP-AMP,SINGLE,CMOS,TSSOP,5PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 3000 µV | |
JESD-30 Code | R-PDSO-G5 | |
Low-Bias | YES | |
Low-Offset | NO | |
Micropower | YES | |
Number of Functions | 1 | |
Number of Terminals | 5 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP5/6,.08 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TAPE AND REEL | |
Power | NO | |
Qualification Status | Not Qualified | |
Slew Rate-Nom | 0.14 V/us | |
Supply Current-Max | 0.09 mA | |
Supply Voltage Limit-Max | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | DUAL | |
Voltage Gain-Min | 100 | |
Wideband | NO |