Part Details for TD62S312AFM by Toshiba America Electronic Components
Overview of TD62S312AFM by Toshiba America Electronic Components
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Aerospace and Defense
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Part Details for TD62S312AFM
TD62S312AFM CAD Models
TD62S312AFM Part Data Attributes
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TD62S312AFM
Toshiba America Electronic Components
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TD62S312AFM
Toshiba America Electronic Components
IC 0.1 A BUF OR INV BASED PRPHL DRVR, PDSO6, 3 X 3 MM, 0.95 MM PITCH, HEAT SINK, PLASTIC, SON-6, Peripheral Driver
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | SON | |
| Package Description | HVSON, SOLCC6,.13,38 | |
| Pin Count | 6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Built-in Protections | TRANSIENT | |
| Driver Number of Bits | 1 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-N6 | |
| JESD-609 Code | e0 | |
| Length | 2.9 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current Flow Direction | SOURCE | |
| Output Current-Max | 0.1 A | |
| Output Peak Current Limit-Nom | 0.1 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC6,.13,38 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max | 50 V | |
| Supply Voltage-Nom | 50 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.95 mm | |
| Terminal Position | DUAL | |
| Width | 2.8 mm |