Part Details for TDA8035HN/C1,157 by NXP Semiconductors
Overview of TDA8035HN/C1,157 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for TDA8035HN/C1,157
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
24T9117
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Newark | Smart Card Interface, -25 To 85Deg C, Ic Interface Type:Smart Card, Interface Applications:Electronic Payments, Identification, Bank Card Readers, Pay Tv, Supply Voltage Min:2.7V, Supply Voltage Max:5.5V, Interface Case Style:Hvqfn Rohs Compliant: Yes |Nxp TDA8035HN/C1,157 RoHS: Compliant Min Qty: 2450 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$0.6050 / $0.7730 | Buy Now |
DISTI #
TDA8035HN/C1,157-ND
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DigiKey | IC INTFACE SPECIALIZED 32HVQFN Min Qty: 2450 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$0.6579 | Buy Now |
DISTI #
TDA8035HN/C1,157
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Avnet Americas | Smart Card Interface 32-Pin HVQFN EP Tray - Trays (Alt: TDA8035HN/C1,157) RoHS: Compliant Min Qty: 538 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 28959 Partner Stock |
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RFQ | |
DISTI #
TDA8035HN/C1,157
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Avnet Americas | Smart Card Interface 32-Pin HVQFN EP Tray - Trays (Alt: TDA8035HN/C1,157) RoHS: Compliant Min Qty: 2450 Package Multiple: 2450 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$0.5677 / $0.6514 | Buy Now |
DISTI #
771-TDA8035HN/C1157
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Mouser Electronics | Smart Card Interface ICs SMART CARD INTERFACE RoHS: Compliant | 0 |
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$0.6170 / $0.6470 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2450 Package Multiple: 2450 Lead time: 13 Weeks Container: Tray | 0Tray |
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$0.5680 | Buy Now |
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Rochester Electronics | TDA8035HN - High integrated and low power smart card interface RoHS: Compliant Status: Active Min Qty: 1 | 28959 |
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$0.5768 / $0.6786 | Buy Now |
DISTI #
TDA8035HN/C1,157
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Avnet Silica | Smart Card Interface 32-Pin HVQFN EP Tray (Alt: TDA8035HN/C1,157) RoHS: Compliant Min Qty: 2450 Package Multiple: 2450 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for TDA8035HN/C1,157
TDA8035HN/C1,157 CAD Models
TDA8035HN/C1,157 Part Data Attributes
|
TDA8035HN/C1,157
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
TDA8035HN/C1,157
NXP Semiconductors
TDA8035HN - High integrated and low power smart card interface QFN 32-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQFN-32 | |
Pin Count | 32 | |
Manufacturer Package Code | SOT617-7 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PQCC-N32 | |
Length | 5 mm | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 32 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC32,.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Supply Current-Max | 220 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 5 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |