There are no models available for this part yet.
Overview of TEA5582PN by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Audio and Video Systems
Entertainment and Gaming
CAD Models for TEA5582PN by NXP Semiconductors
Part Data Attributes for TEA5582PN by NXP Semiconductors
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
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Package Description
|
DIP,
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.39.00.01
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Consumer IC Type
|
CONSUMER CIRCUIT
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JESD-30 Code
|
R-PDIP-T20
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Length
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26.73 mm
|
Number of Terminals
|
20
|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
DIP
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Package Equivalence Code
|
DIP20,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Qualification Status
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Not Qualified
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Seated Height-Max
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4.2 mm
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Supply Current-Max
|
25 mA
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Supply Voltage-Max (Vsup)
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16 V
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Supply Voltage-Min (Vsup)
|
7 V
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Surface Mount
|
NO
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Temperature Grade
|
COMMERCIAL
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Terminal Form
|
THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
|
DUAL
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Width
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7.62 mm
|