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TLC555CDR by: Texas Instruments
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Price & Stock for: TLC555CDR

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark 2,082 1 TAPE & REEL CUT
  • 1 $1.1300
  • 10 $1.0500
  • 25 $0.9820
  • 50 $0.9180
  • 100 $0.8540
  • 250 $0.7980
  • 500 $0.7570
  • 1,000 $0.7240
View this part on Bristol Electronics 751 1
View this part on Bristol Electronics 473 1
View this part on RS Components 200 10 Package
  • 10 $0.9030
  • 30 $0.7410
  • 60 $0.6390
  • 200 $0.5410
  • 400 $0.5270
View this part on RS Components 14,530 10 Reel
  • 10 $0.9030
  • 30 $0.7410
  • 60 $0.6390
  • 200 $0.5410
  • 400 $0.5270

Purchasing Insights: TLC555CDR

Historical Trends

Estimated Price History

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

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161,713

Part Details for: TLC555CDR

CAD Models

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: TLC555CDR

Part Number Description Manufacturer Compare
KA555D Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, SOP-8 Rochester Electronics LLC TLC555CDR vs KA555D
KA555IDTF Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, SOIC-8 Rochester Electronics LLC TLC555CDR vs KA555IDTF
TLC555IDR Signal Circuits 2.1-MHz, 250-µA, Low-Power Timer 8-SOIC -40 to 85 Texas Instruments TLC555CDR vs TLC555IDR
ICM7555CD/01,118 Signal Circuits ICM7555CDSOT96-1 NXP Semiconductors TLC555CDR vs ICM7555CD/01,118
TLC555QDREP Signal Circuits PULSE; RECTANGULAR, 1.2MHz, TIMER, PDSO8, GREEN, PLASTIC, SOP-8 Texas Instruments TLC555CDR vs TLC555QDREP
MC1455BDG Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, PLASTIC, SO-8 onsemi TLC555CDR vs MC1455BDG
Part Number Description Manufacturer Compare
ICM7555IBA Signal Circuits 1 Func, 0.1MHz, CMOS, PDSO8 Harris Semiconductor TLC555CDR vs ICM7555IBA
KA555D Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, SOP-8 Rochester Electronics LLC TLC555CDR vs KA555D
ICM7555CBA-T Signal Circuits Analog Waveform Generation Function, CMOS, PDSO8 Harris Semiconductor TLC555CDR vs ICM7555CBA-T
TLC555IDR Signal Circuits 2.1-MHz, 250-µA, Low-Power Timer 8-SOIC -40 to 85 Texas Instruments TLC555CDR vs TLC555IDR
NA556NE4 Signal Circuits PULSE; RECTANGULAR, TIMER, PDIP14, ROHS COMPLIANT, PLASTIC, DIP-14 Texas Instruments TLC555CDR vs NA556NE4
TLC555QDREP Signal Circuits PULSE; RECTANGULAR, 1.2MHz, TIMER, PDSO8, GREEN, PLASTIC, SOP-8 Texas Instruments TLC555CDR vs TLC555QDREP
ICM7555CD/01,118 Signal Circuits ICM7555CDSOT96-1 NXP Semiconductors TLC555CDR vs ICM7555CD/01,118
MC1455BDG Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, PLASTIC, SO-8 onsemi TLC555CDR vs MC1455BDG
KA555IDTF Signal Circuits PULSE; RECTANGULAR, TIMER, PDSO8, SOIC-8 Rochester Electronics LLC TLC555CDR vs KA555IDTF
CA0555M96 Signal Circuits 1 Func, PDSO8 Rochester Electronics LLC TLC555CDR vs CA0555M96

Resources and Additional Insights

Reference Designs

  • Sync Buck for Intel Atom E6xx Tunnel Creek (1.1V @ 3.5A)
    PMP5922.1: TI's Highest Power Density Low Input Voltage Complete Intel Atom E6xx (Tunnel Creek) power system designs; in 967mm2 this design has all the voltage regulators needed to power Intel's Atom E6xx CPU platform and fit onto a 70x70 or smaller COM Express Module used in Industrial Automation and Process Control applications.
  • PMP20490 High-Density 12Vin, 1.2Vout, 60A POL Reference Design with Stacked TPS546C20A PMBus DCDC Converters | TI.com
    PMP20490: The TPS546C23 provides a single IC for both control & the synchronous power stage for high current DC/DC applications and allows doubling of the current capability with use of two of the same part. Multi-phase also allows output ripple cancellation and effective higher bandwidth control for a given switching frequency. PMP20490 shows a high current two phase application with inductors on top of control ICs for smaller footprint and two on board dynamic loads. The test report shows performance and efficiency with two sources of inductors.
  • Intel IMVP7 2nd Generation Core Mobile (Core i7) Power Management Reference Design
    TIDA-00020: The Intel Core i7 power management design is a complete solution for the Intel™ IMVP-7 Serial VID (SVID) Power System The design features an IMVP-7 3-Phase CPU supply, a single-phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.
  • Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design
    TIDA-00021: The Intel Core i7 power management design is a complete solution for Intel IMVP-7 SVID. A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC Controller. The design features an IMVP-7 3-Phase CPU supply, a 2 Phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.
  • 5V, 3-Phase, Sensorless, Sinusoidal Motor System With Variable Speed Control
    TIDA-00114: This BLDC motor system implements a DRV10963, a TLC555 timer, and a generic 5V motor. The sinusoidal control scheme is suitable for small fan applications where low noise is desired. Motor voltage support is 2.1V to 5.5V, and max current is 500mA. Motor speed is controlled by the PWM input. Low quiescent current standby mode is available. The motor drive stage has integrated protection, including short-circuit, shoot-through, under-voltage, over-temperature, and locked rotor detection.
  • PMP2688 Power Solution for Automotive Audio Amplifiers | TI.com
    PMP2688: This reference design supports the supply for an audio amplifier, such as the TAS5414C-Q1 using the various DC/DC power switchers, LDOs, logic, clocks, and op amps. This reference design is also applicable in start/stop systems. Modifying this reference design can also create a power supply for a radio head unit.
  • Power Solution for Automotive Audio Amplifiers
    PMP2688: This reference design supports the supply for an audio amplifier, such as the TAS5414C-Q1 using the various DC/DC power switchers, LDOs, logic, clocks, and op amps. This reference design is also applicable in start/stop systems. Modifying this reference design can also create a power supply for a radio head unit.
  • TIDA-00114 5V, 3-Phase, Sensorless, Sinusoidal Motor System With Variable Speed Control | TI.com
    TIDA-00114: This BLDC motor system implements a DRV10963, a TLC555 timer, and a generic 5V motor. The sinusoidal control scheme is suitable for small fan applications where low noise is desired. Motor voltage support is 2.1V to 5.5V, and max current is 500mA. Motor speed is controlled by the PWM input. Low quiescent current standby mode is available. The motor drive stage has integrated protection, including short-circuit, shoot-through, under-voltage, over-temperature, and locked rotor detection.
  • TIDA-00112 5V, 3-Phase, Sensorless Motor System With Variable Speed Control | TI.com
    TIDA-00112: This reference design provides a simple way to spin and control a 5V, 3-phase, BLDC fan motor with minimum development time and overhead. It utilizes the DRV10866, a sensorless BLDC motor driver, for the power stage and a TLC555 timer to provide a variable duty cycle PWM signal for speed control. The DRV10866 uses a 150 degree sensorless BEMF control scheme that takes away the need for external sensors on the motor.
  • PMP5922 Sync Buck for Intel Atom E6xx Tunnel Creek (1.25V @ 10mA) | TI.com
    PMP5922: TI's Highest Power Density Low Input Voltage Complete Intel Atom E6xx (Tunnel Creek) power system designs; in 967mm2 this design has all the voltage regulators needed to power Intel's Atom E6xx CPU platform and fit onto a 70x70 or smaller COM Express Module used in Industrial Automation and Process Control applications.
  • PMP5922 Sync Buck for Intel Atom E6xx Tunnel Creek (1.25V @ 10mA) | TI.com
    PMP5922: TI's Highest Power Density Low Input Voltage Complete Intel Atom E6xx (Tunnel Creek) power system designs; in 967mm2 this design has all the voltage regulators needed to power Intel's Atom E6xx CPU platform and fit onto a 70x70 or smaller COM Express Module used in Industrial Automation and Process Control applications.
  • Double Boost TPS40210
  • 5V, 3-Phase, Sensorless Motor System With Variable Speed Control
    TIDA-00112: This reference design provides a simple way to spin and control a 5V, 3-phase, BLDC fan motor with minimum development time and overhead. It utilizes the DRV10866, a sensorless BLDC motor driver, for the power stage and a TLC555 timer to provide a variable duty cycle PWM signal for speed control. The DRV10866 uses a 150 degree sensorless BEMF control scheme that takes away the need for external sensors on the motor.
  • PMP2663 Double Boost TPS40210 | TI.com

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