Part Details for TLV2763IDGS by Texas Instruments
Results Overview of TLV2763IDGS by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TLV2763IDGS Information
TLV2763IDGS by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
US Tariff Estimator: TLV2763IDGS by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for TLV2763IDGS
TLV2763IDGS CAD Models
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TLV2763IDGS Part Data Attributes
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TLV2763IDGS
Texas Instruments
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Datasheet
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TLV2763IDGS
Texas Instruments
Dual, 3.6-V, 500-kHz, RRIO operational amplifier with shutdown 10-VSSOP -40 to 85
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | MSOP | |
| Pin Count | 10 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.0002 µA | |
| Bias Current-Max (IIB) @25C | 0.000015 µA | |
| Common-mode Reject Ratio-Min | 55 dB | |
| Common-mode Reject Ratio-Nom | 76 dB | |
| Frequency Compensation | YES | |
| Input Offset Current-Max (IIO) | 0.000015 µA | |
| Input Offset Voltage-Max | 3500 µV | |
| JESD-30 Code | S-PDSO-G10 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 2 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP10,.19,20 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Slew Rate-Min | 0.07 V/us | |
| Slew Rate-Nom | 0.22 V/us | |
| Supply Current-Max | 0.056 mA | |
| Supply Voltage Limit-Max | 4 V | |
| Supply Voltage-Nom (Vsup) | 2.4 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Unity Gain BW-Nom | 500 | |
| Voltage Gain-Min | 18000 | |
| Wideband | NO | |
| Width | 3 mm |
Alternate Parts for TLV2763IDGS
This table gives cross-reference parts and alternative options found for TLV2763IDGS. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV2763IDGS, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TLV2763IDGSG4 | Texas Instruments | Check for Price | Dual 1.8-V, Micro-power, Rail-to-Rail, Single Supply Amplifier with Shutdown 10-VSSOP -40 to 85 | TLV2763IDGS vs TLV2763IDGSG4 |
TLV2763IDGS Frequently Asked Questions (FAQ)
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The TLV2763IDGS is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure signal integrity. Place the device close to the power supply, use a solid ground plane, and keep the input and output traces short and separate.
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To ensure proper operation, power up the TLV2763IDGS after the power supplies have stabilized. Power down the device before powering down the supplies. Follow the recommended power-up and power-down sequencing in the datasheet to prevent latch-up or other issues.
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The TLV2763IDGS can drive capacitive loads up to 100 pF. However, it's recommended to limit the capacitive load to 10 pF or less to ensure stability and prevent oscillations.
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Use a low-pass filter, such as an RC filter or an active filter, to filter out noise and ripple in the output of the TLV2763IDGS. The filter's cutoff frequency should be set to at least 10 times the frequency of interest to ensure that the desired signal is not attenuated.
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The thermal impedance of the TLV2763IDGS package (DGS) is approximately 45°C/W (junction-to-ambient). This value can be used to estimate the junction temperature of the device under different operating conditions.