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TMS32C6415EGLZA5E0 by: Texas Instruments

C64x fixed point DSP- up to 720MHz, McBSP, PCI 532-FCBGA -40 to 105

Part Details for TMS32C6415EGLZA5E0 by Texas Instruments

Results Overview of TMS32C6415EGLZA5E0 by Texas Instruments

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TMS32C6415EGLZA5E0 Information

TMS32C6415EGLZA5E0 by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
TMS32C6415EGLZA5E0 Texas Instruments Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105

Price & Stock for TMS32C6415EGLZA5E0

Part # Distributor Description Stock Price Buy
Vyrian Peripheral ICs 56
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US Tariff Estimator: TMS32C6415EGLZA5E0 by Texas Instruments

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Part Details for TMS32C6415EGLZA5E0

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TMS32C6415EGLZA5E0 Part Data Attributes

TMS32C6415EGLZA5E0 Texas Instruments
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TMS32C6415EGLZA5E0 Texas Instruments C64x fixed point DSP- up to 720MHz, McBSP, PCI 532-FCBGA -40 to 105
Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Obsolete
Part Package Code BGA
Package Description 23 X 23 Mm, 0.80 Mm Pitch, Plastic, Bga-532
Pin Count 532
Reach Compliance Code Not Compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature Also Requires 3.3vi/O Supply
Address Bus Width 32
Barrel Shifter No
Bit Size 32
Boundary Scan Yes
Clock Frequency-Max 75.18 Mhz
External Data Bus Width 64
Format Fixed Point
Integrated Cache Yes
Internal Bus Architecture Multiple
JESD-30 Code S-PBGA-B532
JESD-609 Code e0
Length 23 Mm
Low Power Mode Yes
Moisture Sensitivity Level 4
Number of DMA Channels 64
Number of External Interrupts 4
Number of Terminals 532
Number of Timers 3
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material Plastic/Epoxy
Package Code HFBGA
Package Equivalence Code BGA532,26X26,32
Package Shape Square
Package Style Grid Array, Heat Sink/Slug, Fine Pitch
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
RAM (words) 16384
Seated Height-Max 3.3 Mm
Supply Current-Max 125 Ma
Supply Voltage-Max 1.31 V
Supply Voltage-Min 1.19 V
Supply Voltage-Nom 1.25 V
Surface Mount Yes
Technology Cmos
Temperature Grade Industrial
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form Ball
Terminal Pitch 0.8 Mm
Terminal Position Bottom
Time@Peak Reflow Temperature-Max (s) Not Specified
Width 23 Mm
uPs/uCs/Peripheral ICs Type Digital Signal Processor, Other

Alternate Parts for TMS32C6415EGLZA5E0

This table gives cross-reference parts and alternative options found for TMS32C6415EGLZA5E0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS32C6415EGLZA5E0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TMS32C6415EGLZ5E0 Texas Instruments Check for Price C64x fixed point DSP- up to 720MHz, McBSP, PCI 532-FCBGA 0 to 90 TMS32C6415EGLZA5E0 vs TMS32C6415EGLZ5E0
TMS32C6415EZLZA5E0 Texas Instruments Check for Price C64x fixed point DSP- up to 720MHz, McBSP, PCI 532-FCBGA -40 to 105 TMS32C6415EGLZA5E0 vs TMS32C6415EZLZA5E0
equivalents icon

TMS32C6415EGLZA5E0 Related Parts

TMS32C6415EGLZA5E0 Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply the core voltage (VDD) first, followed by the input/output voltage (VDDIO), and then the clock signal. This ensures proper device operation and prevents latch-up.

  • To configure the EMIF for optimal performance, ensure that the memory clock frequency is set correctly, and the memory timing parameters (e.g., CAS latency, RAS-to-CAS delay) are configured according to the memory device specifications. Additionally, consider using the EMIF's built-in features, such as data strobe and data masking, to improve data transfer efficiency.

  • The maximum operating frequency of the TMS320C6415EGLZA5E0 is 1 GHz. However, the actual operating frequency may be limited by the specific application, system design, and thermal considerations.

  • The TMS320C6415EGLZA5E0 has a built-in watchdog timer module. To implement a watchdog timer, configure the watchdog timer module to generate a reset signal if the timer expires. This can be done by setting the watchdog timer period, enabling the watchdog timer, and configuring the reset signal generation.

  • The ECC feature on the TMS320C6415EGLZA5E0 is used to detect and correct single-bit errors in external memory. This feature helps to improve system reliability and data integrity by detecting and correcting errors in real-time.

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