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Memory DRAMs TMS427809AP-50DGC

Memory
TMS427809AP-50DGC
Texas Instruments
Description: 2MX8 EDO DRAM, 50ns, PDSO28, 0.400 INCH, PLASTIC, TSOP-28

Overview of TMS427809AP-50DGC by Texas Instruments

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Where used in Applications: Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

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Part Data Attributes for TMS427809AP-50DGC by Texas Instruments
Parametric Data

TMS427809AP-50DGC
Texas Instruments
Buy Now
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
Part Package Code
TSOP
Package Description
TSOP2, TSOP28,.46
Pin Count
28
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.02
Access Mode
FAST PAGE WITH EDO
Access Time-Max
50 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/BATTERY BACKUP/SELF REFRESH
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
Length
18.41 mm
Memory Density
16777216 bit
Memory IC Type
EDO DRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
28
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP2
Package Equivalence Code
TSOP28,.46
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Refresh Cycles
2048
Seated Height-Max
1.2 mm
Self Refresh
YES
Standby Current-Max
0.00015 A
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10.16 mm
Want to compare parts?
  1. TMS427809AP-50DGC
    Texas Instruments
    2MX8 EDO DRAM, 50ns, PDSO28, 0.400 INCH, PLASTIC, TSOP-28
    VS

Alternate Parts for TMS427809AP-50DGC

This table gives cross-reference parts and alternative options found for TMS427809AP-50DGC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS427809AP-50DGC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MSM51V17805DSL-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 LAPIS Semiconductor Co Ltd TMS427809AP-50DGC vs MSM51V17805DSL-50TS-K
TMS426809A-50DGC 2MX8 EDO DRAM, 50ns, PDSO28 Texas Instruments TMS427809AP-50DGC vs TMS426809A-50DGC
MSM51V16805D-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 LAPIS Semiconductor Co Ltd TMS427809AP-50DGC vs MSM51V16805D-50TS-K
IC41LV82002-50T EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, TSOP2-28 Integrated Silicon Solution Inc TMS427809AP-50DGC vs IC41LV82002-50T
TMS426809AP-50DGC 2MX8 EDO DRAM, 50ns, PDSO28 Texas Instruments TMS427809AP-50DGC vs TMS426809AP-50DGC
HY51V17805BTC-50 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 SK Hynix Inc TMS427809AP-50DGC vs HY51V17805BTC-50
MB81V17805B-50PFTN 2MX8 EDO DRAM, 50ns, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 FUJITSU Semiconductor Limited TMS427809AP-50DGC vs MB81V17805B-50PFTN
GM71V17803CLT-5 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 SK Hynix Inc TMS427809AP-50DGC vs GM71V17803CLT-5
MSM51V17805BSL-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 OKI Electric Industry Co Ltd TMS427809AP-50DGC vs MSM51V17805BSL-50TS-K
IBM0117805PT350 2MX8 EDO DRAM, 50ns, PDSO28, 0.400 X 0.725 INCH, TSOP2-28 IBM TMS427809AP-50DGC vs IBM0117805PT350
Part Number Description Manufacturer Compare
MSM51V17805BSL-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 OKI Electric Industry Co Ltd TMS427809AP-50DGC vs MSM51V17805BSL-50TS-K
HY51V17805BRC-50 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, REVERSE, TSOP2-28 SK Hynix Inc TMS427809AP-50DGC vs HY51V17805BRC-50
MSM51V16805DSL-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 LAPIS Semiconductor Co Ltd TMS427809AP-50DGC vs MSM51V16805DSL-50TS-K
IBM0117805PJ1-50 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 IBM TMS427809AP-50DGC vs IBM0117805PJ1-50
GM71V17803CT-5 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, LG Semicon Co Ltd TMS427809AP-50DGC vs GM71V17803CT-5
KM48V2004CK-5 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Samsung Semiconductor TMS427809AP-50DGC vs KM48V2004CK-5
MB81V17805B-50PFTN EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 FUJITSU Limited TMS427809AP-50DGC vs MB81V17805B-50PFTN
MSM51V17805DSL-50TS-K EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 LAPIS Semiconductor Co Ltd TMS427809AP-50DGC vs MSM51V17805DSL-50TS-K
MSM51V17805D-50JS EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 LAPIS Semiconductor Co Ltd TMS427809AP-50DGC vs MSM51V17805D-50JS
GM71VS17803CJ-5 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, LG Semicon Co Ltd TMS427809AP-50DGC vs GM71VS17803CJ-5

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