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TPD12S016RKTR by: Texas Instruments
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Price & Stock for: TPD12S016RKTR

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark 0 1 TAPE & REEL CUT
  • 1 $1.4600
  • 10 $1.3600
  • 25 $1.2700
  • 50 $1.1900
  • 100 $1.1100
  • 250 $1.0400
  • 500 $0.9830
  • 1,000 $0.9400
View this part on ComS.I.T. USA 95 1
View this part on element14 Asia-Pacific 0 1 Each
  • 1 $1.9700
  • 10 $1.8000
  • 100 $1.3000
  • 250 $1.1500
  • 500 $1.0900
  • 1,000 $1.0400
View this part on element14 Asia-Pacific 0 1 TAPE & REEL CUT
  • 1 $1.8800
  • 10 $1.6800
  • 25 $1.6000
  • 100 $1.4800
View this part on Farnell 0 1 Each
  • 1 $1.2800
  • 10 $0.9650

Purchasing Insights: TPD12S016RKTR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

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Part Details for: TPD12S016RKTR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: TPD12S016RKTR

Part Number Description Manufacturer Compare
TPD12S016PWR Signal Circuits Value-line HDMI companion chip for Portable applications 24-TSSOP -40 to 85 Texas Instruments TPD12S016RKTR vs TPD12S016PWR

Resources and Additional Insights

Reference Designs

  • Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • High Efficiency IP Camera Power Module Reference Design
    TIDA-00079: This IP Camera power module is a highly efficient power solution that enables high performance 1080p operation at the Class 1 PoE power level. This innovative power module, used in the low power DM385-AR331 IP Camera, relies on highly efficient switchers like the TPS5432 that are also very cost effective. The result is, TI delivers a solution that enables high performance while lowering system power to industry leading levels.
  • TIDEP0047 Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design | TI.com
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • TIDEP0076 3D Machine Vision Reference Design Based on AM572x Processor with DLP® Structured Light | TI.com
    TIDEP0076: The TIDEP0076 3D machine vision design describes an embedded 3D scanner based on the structured light principle. A digital camera along with a Sitara™ AM57xx processor System on Chip (SoC) is used to capture reflected light patterns from a DLP4500-based projector. Subsquent processing of captured patterns, calculation of the object's 3D point cloud and its 3D visualization are all performed within the AM57xx processor SoC. This design provides an embedded solution with advantages in power, simplicity, cost and size over a host PC-based implementation.
  • TIDA-00079 Class 1 PoE - High Efficiency IP Camera Power Module Reference Design | TI.com
    TIDA-00079: This IP Camera power module is a highly efficient power solution that enables high performance 1080p operation at the Class 1 PoE power level. This innovative power module, used in the low power DM385-AR331 IP Camera, relies on highly efficient switchers like the TPS5432 that are also very cost effective. The result is, TI delivers a solution that enables high performance while lowering system power to industry leading levels.
  • TIDEP0046 Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design | TI.com
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • TIDEP0078 OPC UA Data Access Server for AM572x Reference Design | TI.com
    TIDEP0078: OPC UA is an industrial machine-to-machine protocol designed to allow interoperability and communication between all machines connected under Industry 4.0. The TIDEP0078 TI Design demonstrates use of the MatrikonOPC™ OPC UA server development kit (SDK) to allow communications using an OPC UA data access (DA) server running embedded in a project or design. The OPC UA DA deals with real-time data and is best suited for industrial automation applications where time is an important aspect of the data. A reference OPC UA server implementation is provided that accesses the GPIO capabilities of the AM572x IDK. The reference code can be extended to provide an OPC UA interface to any data the AM572x IDK board can access including data acquired through Profibus, RS-485, CAN bus, and industrial Ethernet-based protocols such as EtherCAT™ or PROFINET™ using the Programmable Real-time Unit Industrial Communication Subsystems (PRU-ICSS).

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