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TPS3700DDCR by: Texas Instruments

Overview of: TPS3700DDCR by Texas Instruments

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Price & Stock for: TPS3700DDCR

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark
0 1 TAPE & REEL CUT
  • 1 $2.9100
  • 10 $2.7800
  • 25 $2.6400
  • 50 $2.5300
  • 100 $2.4200
  • 250 $2.3400
  • 500 $2.2900
  • 1,000 $2.2500
View this part on Bristol Electronics
24 1
View this part on Ameya Holding Limited
60,000 1
View this part on CHIPMALL.COM LIMITED
188 1
  • 1 $24.0554
  • 30 $23.0374
View this part on element14 Asia-Pacific
0 1 TAPE & REEL CUT
  • 1 $2.9030
  • 10 $2.6517
View this part on Farnell
0 1 TAPE & REEL CUT
  • 1 $2.8624
  • 10 $2.4455
  • 50 $2.2652
  • 100 $2.0848
  • 250 $1.9496
View this part on Farnell
0 100 Reel
  • 100 $2.0848
  • 250 $1.9496
View this part on Sense Electronic Company Limited
5,720 1
View this part on Win Source Electronics
14,965 3
  • 3 $18.1860
  • 7 $15.0810
  • 11 $14.6380
  • 15 $14.1940
  • 19 $13.7500
  • 25 $12.4200

Purchasing Insights: TPS3700DDCR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

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Part Details for: TPS3700DDCR

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Part Details

Parametric Data

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: TPS3700DDCR

Part Number Description Manufacturer Compare
TPS3700DDCR2 Power Circuits High-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-SOT-23-THIN -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700DDCR2
TPS3700QDDCRQ1 Power Circuits Automotive high-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-SOT-23-THIN -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700QDDCRQ1
Part Number Description Manufacturer Compare
ISL9238IRTZ Power Circuits Buck-Boost Narrow VDC Battery Charger with SMBus Interface and USB OTG, TQFN, /Tube Renesas Electronics Corporation TPS3700DDCR vs ISL9238IRTZ
TPS3700QDSERQ1 Power Circuits Automotive high-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-WSON -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700QDSERQ1
ISL9238HRTZ-T7A Power Circuits Buck-Boost Narrow VDC Battery Charger with SMBus Interface and USB OTG; TQFN32; Temp Range: See Datasheet Intersil Corporation TPS3700DDCR vs ISL9238HRTZ-T7A
TPS3700DDCR2 Power Circuits High-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-SOT-23-THIN -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700DDCR2
ISL9238HRTZ-T Power Circuits Buck-Boost Narrow VDC Battery Charger with SMBus Interface and USB OTG, TQFN0/Reel Renesas Electronics Corporation TPS3700DDCR vs ISL9238HRTZ-T
ISL9238HRTZ-TK Power Circuits Buck-Boost Narrow VDC Battery Charger with SMBus Interface and USB OTG, TQFN, /Reel Renesas Electronics Corporation TPS3700DDCR vs ISL9238HRTZ-TK
TPS3700QDDCRQ1 Power Circuits Automotive high-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-SOT-23-THIN -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700QDDCRQ1
TPS3700DSET Power Circuits High-voltage (18-V) window voltage detector for overvoltage and undervoltage monitoring 6-WSON -40 to 125 Texas Instruments TPS3700DDCR vs TPS3700DSET
ISL9238IRTZ-T Power Circuits Buck-Boost Narrow VDC Battery Charger with SMBus Interface and USB OTG; TQFN32; Temp Range: See Datasheet Intersil Corporation TPS3700DDCR vs ISL9238IRTZ-T

Resources and Additional Insights

Reference Designs

  • Thunderbolt™ Single Port Peripheral Reference Design
    TIDA-00268: The TI Thunderbolt™ Single Port Peripheral reference design is optimized for Thunderbolt 2 systems which have a bandwidth of 20Gbps. The design utilizes the TPS65980 power management unit to reduce the BOM cost up to 50% and reduce the area about 40% over a discrete implementation. This design has been tested and certified at Intel for both self power and bus powered single port Thunderbolt systems.
  • PMP9372 Single Phase 60W Audio Amplifier Reference Design | TI.com
    PMP9372: PMP9372 is a single-phase synchronous boost converter, which utilizes the LM5121 controller. Inrush limiting is set to 11A nominal, which allows startup into a 4700μF output capacitor. The TPS3700DDC is used as an output voltage monitor, which provides Power Good signaling of output over-voltage and under-voltage.
  • Single Phase 60W Audio Amplifier Reference Design
    PMP9372: PMP9372 is a single-phase synchronous boost converter, which utilizes the LM5121 controller. Inrush limiting is set to 11A nominal, which allows startup into a 4700μF output capacitor. The TPS3700DDC is used as an output voltage monitor, which provides Power Good signaling of output over-voltage and under-voltage.
  • TIDA-00448 Flexible High Current IGBT Gate Driver with Reinforced Digital Isolator Reference Design | TI.com
    TIDA-00448: The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used for multiple drive platforms with different power ratings. A Digital isolator is used to achieve reinforced isolation with transient surge rating of 8kV and 50kV CMTI. The design incorporates DESAT protection using a fast transient response comparator. The DESAT detection threshold and the soft turn-off time are configurable. The design can interface with PWMs from 3.3 V and 5 V MCUs along with fault, reset and UVLO feedbacks.
  • TIDA-00268 Thunderbolt™ Single Port Peripheral Reference Design | TI.com
    TIDA-00268: The TI Thunderbolt™ Single Port Peripheral reference design is optimized for Thunderbolt 2 systems which have a bandwidth of 20Gbps. The design utilizes the TPS65980 power management unit to reduce the BOM cost up to 50% and reduce the area about 40% over a discrete implementation. This design has been tested and certified at Intel for both self power and bus powered single port Thunderbolt systems.
  • Flexible High Current IGBT Gate Driver with Reinforced Digital Isolator Reference Design
    TIDA-00448: The TIDA-00448 reference design is an isolated IGBT gate driver with bipolar gate voltages intended for driving high power IGBT’s requiring high peak gate current up to 40 A. TI’s NexFET power blocks which scales in this range, with same package, enables single design to be used for multiple drive platforms with different power ratings. A Digital isolator is used to achieve reinforced isolation with transient surge rating of 8kV and 50kV CMTI. The design incorporates DESAT protection using a fast transient response comparator. The DESAT detection threshold and the soft turn-off time are configurable. The design can interface with PWMs from 3.3 V and 5 V MCUs along with fault, reset and UVLO feedbacks.

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