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TPS3808G01DBVR by: Texas Instruments

Overview of: TPS3808G01DBVR by Texas Instruments

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Price & Stock for: TPS3808G01DBVR

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark 0 1 TAPE & REEL CUT
  • 1 $2.3800
  • 10 $2.2700
  • 25 $2.1600
  • 50 $2.0700
  • 100 $1.9800
  • 250 $1.9100
  • 500 $1.8700
  • 1,000 $1.8400
View this part on Bristol Electronics 1,737 1
View this part on Bristol Electronics 660 1
  • 1 $12.0000
  • 5 $9.0000
  • 13 $8.1000
  • 22 $7.5000
  • 55 $7.2000
  • 113 $6.9000
View this part on Ameya Holding Limited 6,000 1
View this part on Chip 1 Exchange 2,071 1

Purchasing Insights: TPS3808G01DBVR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

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Part Details for: TPS3808G01DBVR

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: TPS3808G01DBVR

Part Number Description Manufacturer Compare
TPS3808G01DBVTG4 Power Circuits Low-quiescent current supervisor with programmable delay & manual reset 6-SOT-23 -40 to 125 Texas Instruments TPS3808G01DBVR vs TPS3808G01DBVTG4
TPS3808G01DBVRG4 Power Circuits Low-quiescent current supervisor with programmable delay & manual reset 6-SOT-23 -40 to 125 Texas Instruments TPS3808G01DBVR vs TPS3808G01DBVRG4
Part Number Description Manufacturer Compare
MAX16057ATT29+ Power Circuits Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT29+
MAX16057ATT41+ Power Circuits Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, 3 X 3 MM, ROHS COMPLIANT, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT41+
MAX16057ATT36+ Power Circuits Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, 3 X 3 MM, ROHS COMPLIANT, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT36+
MAX16057ATT35+T Power Circuits Power Supply Support Circuit, Fixed, 1 Channel, +3.5VV, BICMOS, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT35+T
TPS3808G01DBVTG4 Power Circuits Low-quiescent current supervisor with programmable delay & manual reset 6-SOT-23 -40 to 125 Texas Instruments TPS3808G01DBVR vs TPS3808G01DBVTG4
MAX16057ATT31+T Power Circuits Power Supply Support Circuit, Adjustable, 1 Channel, +3.075VV, BICMOS, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT31+T
MAX16057ATT29+T Power Circuits Power Supply Support Circuit, Adjustable, 1 Channel, +2.925VV, BICMOS, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT29+T
MAX16057ATT31+ Power Circuits Power Supply Support Circuit, Fixed, +3.075VV, BICMOS, PDSO6, Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT31+
TPS3808G01DBVRG4 Power Circuits Low-quiescent current supervisor with programmable delay & manual reset 6-SOT-23 -40 to 125 Texas Instruments TPS3808G01DBVR vs TPS3808G01DBVRG4
MAX16057ATT45+T Power Circuits Power Supply Support Circuit, Fixed, 1 Channel, +4.5VV, BICMOS, TDFN-6 Maxim Integrated Products TPS3808G01DBVR vs MAX16057ATT45+T

Resources and Additional Insights

Reference Designs

  • Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • TUSB8040AEVM TUSB8040A Evaluation Module | TI.com
    TUSB8040AEVM: The TUSB8040AEVM board is a free-standing reference design for a four-port SuperSpeed USB (USB 3.0) hub. It is used to evaluate system compatibility. A SuperSpeed enabled host system and cable is required to evaluate SuperSpeed data transfer. The TUSB8040AEVM will work with USB 2.0 hosts systems as a USB 2.0 hub. No software is required to enable the device. The board will work with any operating system that has USB hub class support built in.
  • TIDEP0047 Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design | TI.com
    TIDEP0047: This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes reference material and documentation covering power management design, power distribution network (PDN) design considerations, thermal design considerations, estimating power consumption, and a power consumption summary.
  • Reference Design using TMS320C6657 to Implement Efficient OPUS Codec Solution
    TIDEP0036: The TIDEP0036 reference design provides an example of the ease of running TI optimized Opus encoder/decoder on the TMS320C6657 device. Since Opus supports a a wide range of bit rates, frame sizes and sampling rates, all with low delay, it has applicability for voice communications, networked audio and even high performance audio processing application. This design also highlights the performance improvements achieved when implementing the Opus codec on a DSP vs. a general purpose processor, like ARM. Depending upon the level of optimization of the code running on the genral purpose processor, implementing the Opus Codec on a C66x TI DSP core can have 3X the performance of an ARM CORTEX A-15 implementation. TMS320C66x DSPs support both audio and video codecs.
  • TIDEP0006 Data Concentrator Reference Design | TI.com
    TIDEP0006: The data concentrator reference design gives developers the ultimate level of flexibility and scalability with numerous performance, cost and connectivity options for their data concentrator designs. It includes advanced hardware and software that reduce development time by up to nine months while still supporting connectivity to more than 1,000 smart meters. Developers can easily plug in different connectivity modules, including Sub-1GHz (LPRF), general packet radio service (GPRS), near field communication (NFC) and TI's power line communication (PLC) system-on-module robust G3 and PRIME support.
  • TIDEP0059 G3-PLC (CENELEC Band) Data Concentrator Reference Design | TI.com
    TIDEP0059: The TIDEP0059 reference design implements a complete Power Line Communications (PLC) Data Concentrator based upon the G3-PLC industry standard. It operates in the 36 kHz – 91 kHz band defined by the CENELEC for Smart Grid communications. The reference design includes G3-PLC software which supports the management of up to 1000 G3-PLC end points in a neighborhood area network. The reference design supports the full 312 Kbps data throughput specified by the G3-PLC standard.
  • PMP2092 Buck for Set Top Box (6V @ 1A) | TI.com
  • TIDEP0058 G3-PLC (FCC Band) Data Concentrator Reference Design | TI.com
    TIDEP0058: The TIDEP0058 reference design implements a complete Power Line Communications (PLC) Data Concentrator based upon the G3-PLC industry standard. It operates in the 157 kHz – 487 kHz band defined by the FCC for Smart Grid communications. The reference design includes G3-PLC software which supports the management of up to 1000 G3-PLC end points in a neighborhood area network. The reference design supports the full 312 Kbps data throughput specified by the G3-PLC standard.
  • TIDEP0046 Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design | TI.com
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • TIDEP0036 Reference Design using TMS320C6657 to Implement Efficient OPUS Codec Solution | TI.com
    TIDEP0036: The TIDEP0036 reference design provides an example of the ease of running TI optimized Opus encoder/decoder on the TMS320C6657 device. Since Opus supports a a wide range of bit rates, frame sizes and sampling rates, all with low delay, it has applicability for voice communications, networked audio and even high performance audio processing application. This design also highlights the performance improvements achieved when implementing the Opus codec on a DSP vs. a general purpose processor, like ARM. Depending upon the level of optimization of the code running on the genral purpose processor, implementing the Opus Codec on a C66x TI DSP core can have 3X the performance of an ARM CORTEX A-15 implementation. TMS320C66x DSPs support both audio and video codecs.
  • Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design
    TIDEP0046: TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy for users to utilize DSP acceleration for high computational tasks while using a standard programming model and language, thereby removing the need for deep knowledge of the DSP architecture. The TIDEP0046 TI reference design provides an example of using DSP acceleration to generate a very long sequence of normal random numbers using standard C/C++ code.
  • TUSB8040A Evaluation Module
    TUSB8040AEVM: The TUSB8040AEVM board is a free-standing reference design for a four-port SuperSpeed USB (USB 3.0) hub. It is used to evaluate system compatibility. A SuperSpeed enabled host system and cable is required to evaluate SuperSpeed data transfer. The TUSB8040AEVM will work with USB 2.0 hosts systems as a USB 2.0 hub. No software is required to enable the device. The board will work with any operating system that has USB hub class support built in.

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