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UCC27211DPRT by: Texas Instruments
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Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

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Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

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Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: UCC27211DPRT

Part Number Description Manufacturer Compare
UCC27211DPR Drivers And Interfaces IC HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, PLASTIC, WSON-10, MOSFET Driver Texas Instruments UCC27211DPRT vs UCC27211DPR
Part Number Description Manufacturer Compare
MCP14E11-E/SN Drivers And Interfaces 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 3.90 MM, LEAD FREE, PLASTIC, SOIC-8 Microchip Technology Inc UCC27211DPRT vs MCP14E11-E/SN
UCC27211DR Drivers And Interfaces 4-A, 120-V half bridge gate driver with 8-V UVLO and TTL inputs 8-SOIC -40 to 140 Texas Instruments UCC27211DPRT vs UCC27211DR
MIC4103YM Drivers And Interfaces 3A HALF BRDG BASED MOSFET DRIVER, PDSO8 Microchip Technology Inc UCC27211DPRT vs MIC4103YM
MCP14E11-E/MF Drivers And Interfaces 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 6 X 5 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, DFN-8 Microchip Technology Inc UCC27211DPRT vs MCP14E11-E/MF
MCP14E9-E/P Drivers And Interfaces 3 A HALF BRDG BASED MOSFET DRIVER, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 Microchip Technology Inc UCC27211DPRT vs MCP14E9-E/P
UCC27211DPR Drivers And Interfaces IC HALF BRDG BASED MOSFET DRIVER, PDSO10, 4 X 4 MM, PLASTIC, WSON-10, MOSFET Driver Texas Instruments UCC27211DPRT vs UCC27211DPR
MIC4103YMTR Drivers And Interfaces 3A HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8 Micrel Inc UCC27211DPRT vs MIC4103YMTR
MCP14E10-E/SN Drivers And Interfaces 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 3.90 MM, LEAD FREE, PLASTIC, SOIC-8 Microchip Technology Inc UCC27211DPRT vs MCP14E10-E/SN
UCC27211DDA Drivers And Interfaces 4-A, 120-V half bridge gate driver with 8-V UVLO and TTL inputs 8-SO PowerPAD -40 to 140 Texas Instruments UCC27211DPRT vs UCC27211DDA
MCP14E10T-E/SN Drivers And Interfaces 3 A HALF BRDG BASED MOSFET DRIVER, PDSO8, 3.90 MM, LEAD FREE, PLASTIC, SOIC-8 Microchip Technology Inc UCC27211DPRT vs MCP14E10T-E/SN

Resources and Additional Insights

Reference Designs

  • TIDM-BUCKBOOST-BIDIR Bi-Directional Non-Isolated Buck Boost Converter | TI.com
    TIDM-BUCKBOOST-BIDIR: This design implements a bi-directional, non-isolated buck boost power converter, ideal for solar microconverters, hybrid electric vehicles (HEV) including Regeneration (Regen or Recuperation), and battery charging applications.
  • Bi-Directional Non-Isolated Buck Boost Converter
    TIDM-BUCKBOOST-BIDIR: This design implements a bi-directional, non-isolated buck boost power converter, ideal for solar microconverters, hybrid electric vehicles (HEV) including Regeneration (Regen or Recuperation), and battery charging applications.
  • TIDM-SOLARUINV Grid-tied Solar Micro Inverter with MPPT | TI.com
    TIDM-SOLARUINV: This design is a digitally-controlled, grid-tied, solar micro inverter with maximum power point tracking (MPPT). Solar micro inverters are an emerging segment of the solar power industry. Rather than linking every solar panel in an installation to a central inverter, solar micro inverter-based installations link smaller, or “micro,” inverters individually to each solar panel. This configuration lends itself to many benefits, including elimination of partial shading conditions, increased system efficiency, improved reliability and greater modularity. For this design, a C2000™ Piccolo™ TMS320F28035 microcontroller (MCU) is the digital controller for the complete inverter, including control of the power stages, MPPT, and grid-tie synchronization. The power conversion stages include 1) an active clamp fly-back DC/DC converter with secondary voltage multiplier and 2) a grid-tied, DC/AC inverter. The design achieves 93 percent peak efficiency and less than 4 percent total harmonic distortion, providing more power output per solar panel, reducing detrimental heat dissipation, and increasing system longevity.
  • Grid-tied Solar Micro Inverter with MPPT
    TIDM-SOLARUINV: This design is a digitally-controlled, grid-tied, solar micro inverter with maximum power point tracking (MPPT). Solar micro inverters are an emerging segment of the solar power industry. Rather than linking every solar panel in an installation to a central inverter, solar micro inverter-based installations link smaller, or “micro,” inverters individually to each solar panel. This configuration lends itself to many benefits, including elimination of partial shading conditions, increased system efficiency, improved reliability and greater modularity. For this design, a C2000™ Piccolo™ TMS320F28035 microcontroller (MCU) is the digital controller for the complete inverter, including control of the power stages, MPPT, and grid-tie synchronization. The power conversion stages include 1) an active clamp fly-back DC/DC converter with secondary voltage multiplier and 2) a grid-tied, DC/AC inverter. The design achieves 93 percent peak efficiency and less than 4 percent total harmonic distortion, providing more power output per solar panel, reducing detrimental heat dissipation, and increasing system longevity.
  • Isolated IGBT Gate Driver Evaluation Platform for 3-Phase Inverter System Reference Design
    TIDA-00195: The TIDA-00195 reference design consists of a 22kW power stage with TI’s new reinforced isolated IGBT gate driver ISO5852S intended for motor control in various applications. This design allows performance evaluation of the ISO5852S in 3-phase inverter incorporating 1200V rated IGBT modules of current ratings ranging from 50A-200A. Some of the important functionality and performance evaluated are short circuit protection using DESAT detection, Soft-shutdown, effectiveness of the Active Miller Clamp at different inverter dv/dt, and ESD/EFT performance of IGBT gate driver at system level derived from adjustable speed electrical power drive systems (IEC61800-3). Piccolo launch pad LAUNCHXL-F28027 is used to generate the PWM signals required for controlling the inverter.
  • TIDA-00364 48-VDC Battery Powered 5-KW Inverter Power Stage Reference Design for Forklift AC Traction Motor | TI.com
    TIDA-00364: The TIDA-00364 TI Design provides a reference solution for 3-phase MOSFET based Inverter to drive AC Induction Motor for traction in Forklifts. The Inverter is powered from 48 Vdc lead acid battery. It is designed to deliver 5 KW of output power and can handle continuous motor currents of up to 130 Arms with suitable cooling setup. High current rating is achieved by using multiple MOSFET’s (CSD19536) in parallel, mounted on to thermal clad PCB. 120 V Half bridge MOSFET gate driver with 4 Apk source/sink current is been used to control the MOSFET’s. This design incorporates techniques and measures to operate MOSFET in parallel.
  • PMP8877 1/8 Brick Isolated DC/DC Telecom Power Module Based on UCD3138 Digital Control Reference Design | TI.com
    PMP8877: PMP8877 is a full-function 1/8th brick isolated DC/DC telecom power module based on the UCD3138 digital power controller. The reference design features secondary side control and hard switching full bridge power topology to deliver 12V/180W of output power operating across a wide range 36V-72V input source. The highlights of the reference design include 94% peak efficiency, fast input voltage feedforward response to input voltage surges, constant current/constant power overload protection, pre-bias start-up, current sharing control for paralleled module applications and PMBUS support for communication with peer controllers. The bias supply block employs the UCC25230, while the gate drivers used in this design include UCC27524 for driving the SR MOSFETs and UCC27211 for driving the primary side Half-Bridge MOSFETs. Other components include the ISO7240 for sending signals across the isolation barrier.
  • 1/8 Brick Isolated DC/DC Telecom Power Module Based on UCD3138 Digital Control Reference Design
    PMP8877: PMP8877 is a full-function 1/8th brick isolated DC/DC telecom power module based on the UCD3138 digital power controller. The reference design features secondary side control and hard switching full bridge power topology to deliver 12V/180W of output power operating across a wide range 36V-72V input source. The highlights of the reference design include 94% peak efficiency, fast input voltage feedforward response to input voltage surges, constant current/constant power overload protection, pre-bias start-up, current sharing control for paralleled module applications and PMBUS support for communication with peer controllers. The bias supply block employs the UCC25230, while the gate drivers used in this design include UCC27524 for driving the SR MOSFETs and UCC27211 for driving the primary side Half-Bridge MOSFETs. Other components include the ISO7240 for sending signals across the isolation barrier.
  • TIDA-00195 Isolated IGBT Gate Driver Evaluation Platform for 3-Phase Inverter System Reference Design | TI.com
    TIDA-00195: The TIDA-00195 reference design consists of a 22kW power stage with TI’s new reinforced isolated IGBT gate driver ISO5852S intended for motor control in various applications. This design allows performance evaluation of the ISO5852S in 3-phase inverter incorporating 1200V rated IGBT modules of current ratings ranging from 50A-200A. Some of the important functionality and performance evaluated are short circuit protection using DESAT detection, Soft-shutdown, effectiveness of the Active Miller Clamp at different inverter dv/dt, and ESD/EFT performance of IGBT gate driver at system level derived from adjustable speed electrical power drive systems (IEC61800-3). Piccolo launch pad LAUNCHXL-F28027 is used to generate the PWM signals required for controlling the inverter.

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