Datasheets
UPD77533S1-YHC by:

Telecom Circuit, 1-Func, MOS, PBGA108, 11 X 11 MM, PLASTIC, FBGA-108

Part Details for UPD77533S1-YHC by NEC Electronics Group

Overview of UPD77533S1-YHC by NEC Electronics Group

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for UPD77533S1-YHC

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UPD77533S1-YHC Part Data Attributes:

UPD77533S1-YHC NEC Electronics Group
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UPD77533S1-YHC NEC Electronics Group Telecom Circuit, 1-Func, MOS, PBGA108, 11 X 11 MM, PLASTIC, FBGA-108
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP
Part Package Code BGA
Package Description 11 X 11 MM, PLASTIC, FBGA-108
Pin Count 108
Reach Compliance Code compliant
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B108
JESD-609 Code e0
Length 11 mm
Number of Functions 1
Number of Terminals 108
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 1.66 mm
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology MOS
Telecom IC Type TELECOM CIRCUIT
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 11 mm

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