Part Details for UPD77533S1-YHC by Renesas Electronics Corporation
Overview of UPD77533S1-YHC by Renesas Electronics Corporation
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for UPD77533S1-YHC
UPD77533S1-YHC CAD Models
UPD77533S1-YHC Part Data Attributes:
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UPD77533S1-YHC
Renesas Electronics Corporation
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UPD77533S1-YHC
Renesas Electronics Corporation
SPECIALTY TELECOM CIRCUIT, PBGA108, 11 X 11 MM, PLASTIC, BGA-108
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA108,12X12,32 | |
Pin Count | 108 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B108 | |
Length | 11 mm | |
Number of Functions | 1 | |
Number of Terminals | 108 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA108,12X12,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.66 mm | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | MOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm |