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WL1801MODGBMOCT by: Texas Instruments

Overview of: WL1801MODGBMOCT by Texas Instruments

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Price & Stock for: WL1801MODGBMOCT

Distributor Stock MOQ Package QTY Break / Prices
View this part on Newark 0 1 TAPE & REEL CUT
  • 1 $17.5700
  • 10 $16.8000
  • 25 $15.9600
  • 50 $15.2700
  • 100 $14.6100
View this part on Rochester Electronics 69 1
  • 1 $10.7500
  • 25 $10.5400
  • 100 $10.3200
  • 500 $10.1100
  • 1,000 $9.8900
View this part on element14 Asia-Pacific 0 1 TAPE & REEL CUT
  • 1 $15.7512
  • 10 $15.3356
View this part on Farnell 0 10 Reel
  • 10 $11.3485
  • 50 $10.8579
  • 100 $10.3673
View this part on Farnell 0 1 TAPE & REEL CUT
  • 1 $13.5990
  • 5 $12.4791
  • 10 $11.3485
  • 50 $10.8579
  • 100 $10.3673

Purchasing Insights: WL1801MODGBMOCT

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Estimated Price History

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on Findchips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Market Price Analysis

No data available
  • 1. iBuyXS $149.9400 RFQ

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Part Details for: WL1801MODGBMOCT

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Part Details

Parametric Data

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Findchips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Alternate Parts for: WL1801MODGBMOCT

Part Number Description Manufacturer Compare
XWL1801MODGAMOCT Telecommunication Circuits Texas Instruments XWL1801MODGAMOCT Texas Instruments WL1801MODGBMOCT vs XWL1801MODGAMOCT
Part Number Description Manufacturer Compare
XWL1801MODGAMOCT Telecommunication Circuits Texas Instruments XWL1801MODGAMOCT Texas Instruments WL1801MODGBMOCT vs XWL1801MODGAMOCT
XWL1835MODGAMOCR Telecommunication Circuits IC SPECIALTY TELECOM CIRCUIT, Telecom IC:Other Texas Instruments WL1801MODGBMOCT vs XWL1835MODGAMOCR
WL1805MODGBMOCT Telecommunication Circuits WiLink™ 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70 Texas Instruments WL1801MODGBMOCT vs WL1805MODGBMOCT
WL1831MODGBMOC Telecommunication Circuits IC SPECIALTY TELECOM CIRCUIT, Telecom IC:Other Texas Instruments WL1801MODGBMOCT vs WL1831MODGBMOC
WL1805MODGBMOC Telecommunication Circuits IC SPECIALTY TELECOM CIRCUIT, Telecom IC:Other Texas Instruments WL1801MODGBMOCT vs WL1805MODGBMOC
WL1835MODGBMOC Telecommunication Circuits IC SPECIALTY TELECOM CIRCUIT, Telecom IC:Other Texas Instruments WL1801MODGBMOCT vs WL1835MODGBMOC
WL1805MODGBMOCR Telecommunication Circuits WiLink™ 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70 Texas Instruments WL1801MODGBMOCT vs WL1805MODGBMOCR
XWL1805MODGAMOCT Telecommunication Circuits Texas Instruments XWL1805MODGAMOCT Texas Instruments WL1801MODGBMOCT vs XWL1805MODGAMOCT
WL1831MODGBMOCT Telecommunication Circuits WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70 Texas Instruments WL1801MODGBMOCT vs WL1831MODGBMOCT
WL1835MODGBMOCT Telecommunication Circuits WiLink™ 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module 100-QFM -20 to 70 Texas Instruments WL1801MODGBMOCT vs WL1835MODGBMOCT

Resources and Additional Insights

Reference Designs

  • TIDC-WL1835MODCOM8B 2.4 GHz WiFi® + Bluetooth® Certified Antenna Design on WiLink™ 1835 Module | TI.com
    TIDC-WL1835MODCOM8B: The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through embedded applications such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth Low Energy functionalities found on the WiLink 1835 module. This antenna design leverages the use of its certification by using the same antenna layout when the module was tested for certification, allowing customers to avoid repeated certification when creating their applications.
  • Streaming Audio Reference Design
    TIDEP0009: This Streaming Audio Reference Design aims to minimize design time for customers by offering small form factor hardware and major software components, including streaming protocols and internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink™8 platform solution. This proven combo solution provides key advantages in this market category that helps bring your products to the next level.
  • TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE TI WiLink™8 Wi-Fi®/Bluetooth®/Bluetooth Smart audio multi-room cape reference design | TI.com
    TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE: The TI WiLink™ 8 WL1837MOD ( http://www.ti.com/product/wl1837mod ) audio cape is wireless multi-room audio reference design used with BeagleBone Black (http://www.ti.com/tool/beaglebk featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP’s beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi®/Bluetooth® /Bluetooth Smart solution featuring 2.4 GHz MIMO and antenna diversity on 5 GHz band. It offers best in class audio solution featuring multi-room, Airplay® receiver, full audio stack streaming, support for online music services and much more. This TI Design will enable customers to design their own audio boards with Wi-Fi/Bluetooth /Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software on it. The BeagleBone Wi-Fi Audio Cape extends a standard TI Sitara processor-based BeagleBone Black with WiLink 8 Wi-Fi /Bluetooth /Bluetooth Smart connectivity and an audio subsystem. The cape and relevant SDK are available at an additional cost from StreamUnlimited.
  • TI WiLink™8 Wi-Fi®/Bluetooth®/Bluetooth Smart audio multi-room cape reference design
    TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE: The TI WiLink™ 8 WL1837MOD ( http://www.ti.com/product/wl1837mod ) audio cape is wireless multi-room audio reference design used with BeagleBone Black (http://www.ti.com/tool/beaglebk featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP’s beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi®/Bluetooth® /Bluetooth Smart solution featuring 2.4 GHz MIMO and antenna diversity on 5 GHz band. It offers best in class audio solution featuring multi-room, Airplay® receiver, full audio stack streaming, support for online music services and much more. This TI Design will enable customers to design their own audio boards with Wi-Fi/Bluetooth /Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software on it. The BeagleBone Wi-Fi Audio Cape extends a standard TI Sitara processor-based BeagleBone Black with WiLink 8 Wi-Fi /Bluetooth /Bluetooth Smart connectivity and an audio subsystem. The cape and relevant SDK are available at an additional cost from StreamUnlimited.
  • 2.4 GHz WiFi® + Bluetooth® Certified Antenna Design on WiLink™ 1835 Module
    TIDC-WL1835MODCOM8B: The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through embedded applications such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth Low Energy functionalities found on the WiLink 1835 module. This antenna design leverages the use of its certification by using the same antenna layout when the module was tested for certification, allowing customers to avoid repeated certification when creating their applications.
  • TIDEP0009 Streaming Audio Reference Design | TI.com
    TIDEP0009: This Streaming Audio Reference Design aims to minimize design time for customers by offering small form factor hardware and major software components, including streaming protocols and internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink™8 platform solution. This proven combo solution provides key advantages in this market category that helps bring your products to the next level.

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