There are no models available for this part yet.
Overview of XC2C256-7FTG256I by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 1 replacement )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 4 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
CAD Models for XC2C256-7FTG256I by AMD Xilinx
Part Data Attributes for XC2C256-7FTG256I by AMD Xilinx
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
XILINX INC
|
Part Package Code
|
BGA
|
Package Description
|
17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256
|
Pin Count
|
256
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.39.00.01
|
Factory Lead Time
|
42 Weeks
|
Additional Feature
|
REAL DIGITAL DESIGN TECHNOLOGY
|
Architecture
|
PLA-TYPE
|
Clock Frequency-Max
|
108 MHz
|
In-System Programmable
|
YES
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e1
|
JTAG BST
|
YES
|
Length
|
17 mm
|
Moisture Sensitivity Level
|
3
|
Number of Dedicated Inputs
|
|
Number of I/O Lines
|
184
|
Number of Inputs
|
184
|
Number of Macro Cells
|
256
|
Number of Outputs
|
184
|
Number of Terminals
|
256
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
0 DEDICATED INPUTS, 184 I/O
|
Output Function
|
MACROCELL
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA256,16X16,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel)
|
260
|
Programmable Logic Type
|
FLASH PLD
|
Propagation Delay
|
7.5 ns
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.55 mm
|
Supply Voltage-Max
|
1.9 V
|
Supply Voltage-Min
|
1.7 V
|
Supply Voltage-Nom
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
17 mm
|
Alternate Parts for XC2C256-7FTG256I
This table gives cross-reference parts and alternative options found for XC2C256-7FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2C256-7FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XC2C256-7FT256I | Flash PLD, 7.5ns, 256-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FTBGA-256 | AMD Xilinx | XC2C256-7FTG256I vs XC2C256-7FT256I |
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